公开(公告)号：DE19921113C2

公开(公告)日：2001-11-22

申请号：DE19921113

申请日：1999-05-07

Applicant: INFINEON TECHNOLOGIES AG

Inventor： MUENCH THOMAS ,  POHL JENS ,  WUTZ OLIVER

IPC: H01L21/58 ,  H05K3/32

公开(公告)号：DE19916071B4

公开(公告)日：2005-10-13

申请号：DE19916071

申请日：1999-04-09

Applicant: INFINEON TECHNOLOGIES AG

Inventor： POHL JENS ,  WUTZ OLIVER ,  WINDERL JOHANN

IPC: H01L21/78

Abstract: Semiconductor components, which each include at least one semiconductor chip mounted on a common carrier substrate, are singled. The separation is effected by severing of the carrier substrate. The carrier substrate is thereby bent at least in that area of the carrier substrate which is to be severed. The severing takes place beginning from the convexly curved surface of the carrier substrate. In addition, the invention describes a singling device for separating semiconductor components.