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    2.
    发明专利
    未知

    公开(公告)号：BR9912812A

    公开(公告)日：2001-05-02

    申请号：BR9912812

    申请日：1999-07-12

    Applicant: INFINEON TECHNOLOGIES AG

    Inventor： FRIES MANFRED ,  MUENCH THOMAS ,  FISCHBACH REINHARD

    IPC: G01B7/34 ,  A61B5/1172 ,  G01B7/28 ,  G01B21/00 ,  G06K9/00 ,  G06T1/00 ,  G07C9/00 ,  H01L23/12

    Abstract: In a biometric sensor and a method for its production, a sensor chip is provided with connecting contacts in the form of electrically conductive bumps. The sensor chip is inserted into a chip housing, the bumps making contact with corresponding connecting leads belonging to the chip housing. At the same time as this contact is made, the sensor chip is bonded adhesively into the chip housing by an adhesive layer, which surrounds the sensor field in a sealing manner.

    3.
    发明专利
    未知

    公开(公告)号：AT232322T

    公开(公告)日：2003-02-15

    申请号：AT99961981

    申请日：1999-07-12

    Applicant: INFINEON TECHNOLOGIES AG

    Inventor： FRIES MANFRED ,  MUENCH THOMAS ,  FISCHBACH REINHARD

    IPC: G01B7/34 ,  A61B5/1172 ,  G01B7/28 ,  G01B21/00 ,  G06K9/00 ,  G06T1/00 ,  G07C9/00 ,  H01L23/12

    Abstract: In a biometric sensor and a method for its production, a sensor chip is provided with connecting contacts in the form of electrically conductive bumps. The sensor chip is inserted into a chip housing, the bumps making contact with corresponding connecting leads belonging to the chip housing. At the same time as this contact is made, the sensor chip is bonded adhesively into the chip housing by an adhesive layer, which surrounds the sensor field in a sealing manner.

    5.
    发明专利
    未知

    公开(公告)号：DE59904237D1

    公开(公告)日：2003-03-13

    申请号：DE59904237

    申请日：1999-07-12

    Applicant: INFINEON TECHNOLOGIES AG

    Inventor： FRIES MANFRED ,  MUENCH THOMAS ,  FISCHBACH REINHARD

    IPC: G01B7/34 ,  A61B5/1172 ,  G01B7/28 ,  G01B21/00 ,  G06K9/00 ,  G06T1/00 ,  G07C9/00 ,  H01L23/12

    Abstract: In a biometric sensor and a method for its production, a sensor chip is provided with connecting contacts in the form of electrically conductive bumps. The sensor chip is inserted into a chip housing, the bumps making contact with corresponding connecting leads belonging to the chip housing. At the same time as this contact is made, the sensor chip is bonded adhesively into the chip housing by an adhesive layer, which surrounds the sensor field in a sealing manner.

    6.
    发明专利
    未知

    公开(公告)号：DE10024376A1

    公开(公告)日：2001-12-06

    申请号：DE10024376

    申请日：2000-05-17

    Applicant: INFINEON TECHNOLOGIES AG

    Inventor： WINDERL JOHANN ,  HAUSER CHRISTIAN ,  REISS MARTIN ,  MUENCH THOMAS ,  NEU ACHIM

    IPC: H01L23/31 ,  H01L23/16 ,  H01L21/00 ,  H01L23/50 ,  H01L21/56

    Abstract: The invention relates to a semi-conductor component, comprising a semi-conductor chip having contact pads on the first main surface area thereof. A wiring film is applied to the first main surface area, avoiding the contact pads. On the opposite side of the first main side of the semi-conductor chip, said wiring film has a solder stop mask which covers the conductors. Contact pads lying in at least one groove are wired to the adjacent ends of the conductors in order to connect the contact pads to the soldering contacts lying in the grooves of the solder stop mask. Each wire connection and the end of the conductor thereof is enveloped by a casting material. Said solder stop mask comprises at least one depression and one rise, enabling the casting material to be spread in a directed manner when applied to the semi-conductor component.

    8.
    发明专利
    未知

    公开(公告)号：DE59915065D1

    公开(公告)日：2009-10-01

    申请号：DE59915065

    申请日：1999-02-24

    Applicant: INFINEON TECHNOLOGIES AG

    Inventor： TUTSCH GUENTER ,  MUENCH THOMAS

    IPC: H01L25/10 ,  H01L25/18 ,  H01L23/08 ,  H01L25/11

    Abstract: A modularly expandable semiconductor component includes at least one carrier layer, at least one intermediate layer, at least one coverlayer, at least one semiconductor chip, external contacts and a conductor configuration. The intermediate layer is provided with at least one opening, into which the at least one semiconductor chip is inserted. The carrier layer, the intermediate layer and the coverlayer are connected one above another and form a submodule. If a plurality of submodules are installed above one another, a semiconductor component is provided in which the semiconductor chips are located in several mutually overlying planes. The semiconductor chips can be interconnected. A method for producing a semiconductor component is also provided.

    9.
    发明专利
    未知

    公开(公告)号：DE50302605D1

    公开(公告)日：2006-05-04

    申请号：DE50302605

    申请日：2003-02-05

    Applicant: INFINEON TECHNOLOGIES AG

    Inventor： MUENCH THOMAS

    IPC: H05K1/11 ,  H01L23/057 ,  H01L23/498 ,  H01L23/50 ,  H01L23/538 ,  H01L25/065 ,  H05K1/18 ,  H05K3/40 ,  H05K3/46

    Abstract: A circuit carrier includes a substrate with two oppositely arranged areas. The terminal contacts of a flat connector strip are arranged in the edge regions of the areas. A through contact is arranged under at least one of the terminal contacts with concealed electrical connection to the rear side of the terminal contact and the top side of the terminal contact exhibits an undisturbed morphology and planar surface.

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