公开(公告)号：BR0109645A

公开(公告)日：2003-03-18

申请号：BR0109645

申请日：2001-03-28

Applicant: INFINEON TECHNOLOGIES AG

Inventor： FISCHBACH REINHARD ,  FRIES MANFRED ,  ZAESKE MANFRED

IPC: H01L23/28 ,  H01L21/56

Abstract: A housing assembly forms a package for an electronic device. The housing assembly has the electronic device, an external carrier and a housing frame. A capillary-acting epoxy resin is filled into the assembled housing assembly via a filling-in opening and, on account of its capillary action, closes the interspaces between the semiconductor chip and the housing frame.

公开(公告)号：DE10191266D2

公开(公告)日：2003-06-05

申请号：DE10191266

申请日：2001-03-28

Applicant: INFINEON TECHNOLOGIES AG

Inventor： FISCHBACH REINHARD ,  FRIES MANFRED ,  ZAESKE MANFRED

IPC: H01L23/28 ,  H01L21/56

Abstract: A housing assembly forms a package for an electronic device. The housing assembly has the electronic device, an external carrier and a housing frame. A capillary-acting epoxy resin is filled into the assembled housing assembly via a filling-in opening and, on account of its capillary action, closes the interspaces between the semiconductor chip and the housing frame.

公开(公告)号：DE10016135A1

公开(公告)日：2001-10-18

申请号：DE10016135

申请日：2000-03-31

Applicant: INFINEON TECHNOLOGIES AG ,  SIEMENS AG

Inventor： FRIES MANFRED ,  FISCHBACH REINHARD ,  ZAESKE MANFRED

IPC: H01L23/28 ,  H01L21/56 ,  H01L23/057 ,  H01L23/16 ,  H01L21/52 ,  H05K13/04

Abstract: The invention relates to a housing assembly for an electronic component (1) and to a method for packaging an electronic component, said housing assembly being provided with at least one electronic component (2) to the packaged, an outer support (3) and a housing frame (4). An epoxide resin that has a capillary effect is filled into the assembled housing assembly via a feed opening (7) and closes the cavities between the semiconductor chip and the housing frame by virtue of said capillary effect.

公开(公告)号：CA2404032A1

公开(公告)日：2001-10-11

申请号：CA2404032

申请日：2001-03-28

Applicant: INFINEON TECHNOLOGIES AG

Inventor： ZAESKE MANFRED ,  FISCHACH REINHARD ,  FRIES MANFRED

IPC: H01L23/28 ,  H01L21/56

Abstract: The invention relates to a housing assembly for an electronic component (1) and to a method for packaging an electronic component, said housing assembly being provided with at least one electronic component (2) to the packaged, a n outer support (3) and a housing frame (4). An epoxide resin that has a capillary effect is filled into the assembled housing assembly via a feed opening (7) and closes the cavities between the semiconductor chip and the housing frame by virtue of said capillary effect.

公开(公告)号：AU5460901A

公开(公告)日：2001-10-15

申请号：AU5460901

申请日：2001-03-28

Applicant: INFINEON TECHNOLOGIES AG

Inventor： FISCHBACH REINHARD ,  FRIES MANFRED ,  ZAESKE MANFRED

IPC: H01L23/28 ,  H01L21/56

Abstract: A housing assembly forms a package for an electronic device. The housing assembly has the electronic device, an external carrier and a housing frame. A capillary-acting epoxy resin is filled into the assembled housing assembly via a filling-in opening and, on account of its capillary action, closes the interspaces between the semiconductor chip and the housing frame.