公开(公告)号：WO02073375A3

公开(公告)日：2003-02-06

申请号：PCT/DE0200845

申请日：2002-03-11

Applicant: INFINEON TECHNOLOGIES AG ,  FISCHBACH REINHARD ,  SPOETTL THOMAS ,  MENSCH HANS-GEORG ,  STAMPKA PETER

Inventor： FISCHBACH REINHARD ,  SPOETTL THOMAS ,  MENSCH HANS-GEORG ,  STAMPKA PETER

IPC: G06F21/32 ,  G06F21/34 ,  G07C9/00 ,  G06F1/00

CPC classification number: G06F21/32 ,  G06F21/34

Abstract: According to the invention, a biometric sensor, e.g. a fingerprint sensor FiTiKey, is combined with a standardized medium. The standard of the MultiMediaCard (1) with the corresponding reading devices and with the standardized slots is a preferred embodiment, which consists of the combination of this existing standard for storage applications (MultiMediaCard with the corresponding system peripheral equipment) with the personal, mobile authentication and/or identification key FiTiKey (2) and, optionally, with additional chips (3).

Abstract translation: 它是一种生物传感器等。 指纹传感器FiTiKey与标准介质结合。 MultiMediaCard®（1）的具有适当阅读器和与所述标准化槽（连接器条带）的标准是一个优选实施例，在用于存储器应用此现有标准（MultiMediaCard®与相应的系统外设）发送给个人，移动认证的组合和 /或识别密钥FiTiKey（2）和任选的另外的芯片（3）。

公开(公告)号：DE50014183D1

公开(公告)日：2007-05-03

申请号：DE50014183

申请日：2000-01-13

Applicant: INFINEON TECHNOLOGIES AG

Inventor： OPOLKA HEINZ ,  VON BASSE PAUL-WERNER ,  SCHEITER THOMAS ,  GROSSMANN RAINER ,  PETERS CHRISTIAN ,  FISCHBACH REINHARD ,  GAYMANN ANDREAS ,  ROSTECK THOMAS ,  SIPRAK DOMAGOJ ,  SASSE THORSTEN ,  GOELLNER REINHARD ,  BIERNER JUSTIN ,  MELZL MICHAEL ,  HAMMER KLAUS ,  WITTE MARKUS

IPC: H01L27/02 ,  G06K9/00 ,  H01L27/04 ,  H01L21/822 ,  H01L23/485 ,  H01L23/60 ,  H01L27/06

Abstract: An electronic component is described and has a dielectric layer which is constructed on a substrate, conductive surfaces that are constructed on the dielectric layer, and an electrically conductive guard structure. The guard structure is disposed in a plane above the conductive surfaces such that the conductive surfaces are not completely covered by the guard structure.

公开(公告)号：ES2200917T3

公开(公告)日：2004-03-16

申请号：ES00958203

申请日：2000-08-02

Applicant: INFINEON TECHNOLOGIES AG

Inventor： FRANK MANFRED ,  KRONINGER WERNER ,  KOPNICK RENATE ,  HUMMEL RICHARD ,  FISCHBACH REINHARD ,  OPOLKA HEINZ

IPC: G01B7/28 ,  A61B5/1172 ,  C10M107/38 ,  C10M107/50 ,  C10M173/00 ,  G06K9/00 ,  H01L23/29 ,  H01L23/31

Abstract: To increase the scratch resistance of a surface passivation, in particular, for fingerprint sensors, a antifrictional layer is applied to reduce the shearing forces. The antifrictional layer includes fat, oil, surfactants and/or wax. The antifrictional layer is preferably an emulsion including water, paraffin oil, propylene glycol, stearic acid, palmitic acid, TEA, beeswax, carbormer 954, methylparaben, propylparaben and possibly perfume.

公开(公告)号：ES2192409T3

公开(公告)日：2003-10-01

申请号：ES99961981

申请日：1999-07-12

Applicant: INFINEON TECHNOLOGIES AG

Inventor： FRIES MANFRED ,  MUNCH THOMAS ,  FISCHBACH REINHARD

IPC: G01B7/34 ,  A61B5/1172 ,  G01B7/28 ,  G01B21/00 ,  G06K9/00 ,  G06T1/00 ,  G07C9/00 ,  H01L23/12

Abstract: In a biometric sensor and a method for its production, a sensor chip is provided with connecting contacts in the form of electrically conductive bumps. The sensor chip is inserted into a chip housing, the bumps making contact with corresponding connecting leads belonging to the chip housing. At the same time as this contact is made, the sensor chip is bonded adhesively into the chip housing by an adhesive layer, which surrounds the sensor field in a sealing manner.

公开(公告)号：DE10191266D2

公开(公告)日：2003-06-05

申请号：DE10191266

申请日：2001-03-28

Applicant: INFINEON TECHNOLOGIES AG

Inventor： FISCHBACH REINHARD ,  FRIES MANFRED ,  ZAESKE MANFRED

IPC: H01L23/28 ,  H01L21/56

Abstract: A housing assembly forms a package for an electronic device. The housing assembly has the electronic device, an external carrier and a housing frame. A capillary-acting epoxy resin is filled into the assembled housing assembly via a filling-in opening and, on account of its capillary action, closes the interspaces between the semiconductor chip and the housing frame.

公开(公告)号：ES2182550T3

公开(公告)日：2003-03-01

申请号：ES99936259

申请日：1999-05-17

Applicant: INFINEON TECHNOLOGIES AG

Inventor： FRIES MANFRED ,  FISCHBACH REINHARD ,  HOUDEAU DETLEF

IPC: A61B5/117 ,  A61B5/1172 ,  G06F3/041 ,  G06K9/00 ,  G06K9/20 ,  G06K9/62 ,  G06K11/06 ,  G06T1/00 ,  G06K11/16

Abstract: The sensor device is provided for sensing biometric characteristics, in particular finger minutiae, with a biometric sensor chip. The sensor chip is fastened on a flexible printed circuit board that has a highly flexible substrate layer and conductor tracks applied to the substrate layer. The conductor tracks are in electrical contact with the sensor chip and are led to a terminal region of the flexible printed circuit board. The sensing area of the sensor chip is accessible through an opening in the flexible circuit board and the opening is at least partially surrounded by a grounding frame.

公开(公告)号：DE10191188D2

公开(公告)日：2003-02-20

申请号：DE10191188

申请日：2001-03-22

Applicant: INFINEON TECHNOLOGIES AG

Inventor： FISCHBACH REINHARD ,  FRIES MANFRED

IPC: G06K9/00

Abstract: The housing (30) for biometric sensor chips (1) with a freely accessible fingerprint check surface (2) further includes a carrier substrate (3) in the form of a belt with perforated edges (6) carrying contact elements (4) located partly outside the housing frame (7). The contact area (8) of the sensor chip is joined to the housing frame to form a three-dimensional frame. Also claimed is a method for producing such a housing. It involves structurization of a metal layer on the carrier substrate and positioning of the sensor chip on the resulting structured metal layer.

公开(公告)号：AT232322T

公开(公告)日：2003-02-15

申请号：AT99961981

申请日：1999-07-12

Applicant: INFINEON TECHNOLOGIES AG

Inventor： FRIES MANFRED ,  MUENCH THOMAS ,  FISCHBACH REINHARD

IPC: G01B7/34 ,  A61B5/1172 ,  G01B7/28 ,  G01B21/00 ,  G06K9/00 ,  G06T1/00 ,  G07C9/00 ,  H01L23/12

Abstract: In a biometric sensor and a method for its production, a sensor chip is provided with connecting contacts in the form of electrically conductive bumps. The sensor chip is inserted into a chip housing, the bumps making contact with corresponding connecting leads belonging to the chip housing. At the same time as this contact is made, the sensor chip is bonded adhesively into the chip housing by an adhesive layer, which surrounds the sensor field in a sealing manner.

公开(公告)号：DE10111805A1

公开(公告)日：2002-09-26

申请号：DE10111805

申请日：2001-03-12

Applicant: INFINEON TECHNOLOGIES AG

Inventor： MENSCH HANS ,  SPOETTL THOMAS ,  STAMPKA PETER ,  FISCHBACH REINHARD

IPC: G06F21/32 ,  G06F21/34 ,  G07F7/12

Abstract: According to the invention, a biometric sensor, e.g. a fingerprint sensor FiTiKey, is combined with a standardized medium. The standard of the MultiMediaCard (1) with the corresponding reading devices and with the standardized slots is a preferred embodiment, which consists of the combination of this existing standard for storage applications (MultiMediaCard with the corresponding system peripheral equipment) with the personal, mobile authentication and/or identification key FiTiKey (2) and, optionally, with additional chips (3).

公开(公告)号：DE10016135A1

公开(公告)日：2001-10-18

申请号：DE10016135

申请日：2000-03-31

Applicant: INFINEON TECHNOLOGIES AG ,  SIEMENS AG

Inventor： FRIES MANFRED ,  FISCHBACH REINHARD ,  ZAESKE MANFRED

IPC: H01L23/28 ,  H01L21/56 ,  H01L23/057 ,  H01L23/16 ,  H01L21/52 ,  H05K13/04

Abstract: The invention relates to a housing assembly for an electronic component (1) and to a method for packaging an electronic component, said housing assembly being provided with at least one electronic component (2) to the packaged, an outer support (3) and a housing frame (4). An epoxide resin that has a capillary effect is filled into the assembled housing assembly via a feed opening (7) and closes the cavities between the semiconductor chip and the housing frame by virtue of said capillary effect.