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公开(公告)号:US20140217362A1
公开(公告)日:2014-08-07
申请号:US13812503
申请日:2012-10-12
Inventor: Xiaolong Ma , Huaxiang Yin , Sen Xu , Huilong Zhu
CPC classification number: H01L29/15 , B82Y10/00 , H01L29/1054 , H01L29/151 , H01L29/165 , H01L29/517 , H01L29/66431 , H01L29/66795 , H01L29/7781 , H01L29/785 , H01L29/7853
Abstract: The present invention discloses a method for manufacturing a semiconductor device, which comprises: forming a plurality of fins on a substrate, which extend along a first direction and have rhombus-like cross-sections; forming a gate stack structure on each fin, which traverses the plurality of fins and extends along a second direction; wherein a portion in each fin that is under the gate stack structure forms a channel region of the device, and portions in each fin that are at both sides of the gate stack structure along the first direction form source and drain regions. The semiconductor device and its manufacturing method according to the present invention use rhombus-like fins to improve the gate control capability to effectively suppress the short channel effect, moreover, an epitaxial quantum well is used therein to better limit the carriers, thus improving the device drive capability.
Abstract translation: 本发明公开了一种半导体器件的制造方法,其特征在于,在基板上形成沿着第一方向延伸并具有菱形状的横截面的多个翅片, 在每个翅片上形成栅极堆叠结构,其横过所述多个翅片并沿着第二方向延伸; 其中位于所述栅极堆叠结构下方的每个鳍中的部分形成所述器件的沟道区,并且沿着所述第一方向位于所述栅极堆叠结构两侧的每个鳍中的部分形成源极和漏极区。 根据本发明的半导体器件及其制造方法使用菱形翅片来提高栅极控制能力以有效地抑制短沟道效应,此外,在其中使用外延量子阱以更好地限制载流子,从而改善器件 驱动能力。