公开(公告)号：FR2550905B1

公开(公告)日：1989-06-09

申请号：FR8412979

申请日：1984-08-20

Applicant: INT COMPUTERS LTD

Inventor： THOMPSON GORDON LESLIE ,  GUDGEON BRIAN ,  WOMBWELL KENNETH JAMES

IPC: H05K3/46 ,  H05K1/00 ,  H05K1/11 ,  H05K1/18 ,  H05K3/00 ,  H05K3/22 ,  H05K3/34 ,  H05K3/42 ,  H05K3/40

Abstract: A printed circuit board which facilitates the removal and replacement of components. The circuit board (1) has unplated holes (8) extending therethrough for receiving connection pins (3) of components (2) mounted on one face of the circuit board (1). The pins (3) protrude from the opposite face of the circuit board (1) and are soldered to conductive pads (9) on this face which are connected by surface conductors (10) to plated through-holes (4) linking conductive tracks (6,7) at different layers of the circuit board (1).

公开(公告)号：DE3428811A1

公开(公告)日：1985-03-07

申请号：DE3428811

申请日：1984-08-04

Applicant: INT COMPUTERS LTD

Inventor： THOMPSON GORDON LESLIE ,  GUDGEON BRIAN ,  WOMBWELL KENNETH JAMES

IPC: H05K3/46 ,  H05K1/00 ,  H05K1/11 ,  H05K1/18 ,  H05K3/00 ,  H05K3/22 ,  H05K3/34 ,  H05K3/42 ,  H05K3/30

Abstract: A printed circuit board which facilitates the removal and replacement of components. The circuit board (1) has unplated holes (8) extending therethrough for receiving connection pins (3) of components (2) mounted on one face of the circuit board (1). The pins (3) protrude from the opposite face of the circuit board (1) and are soldered to conductive pads (9) on this face which are connected by surface conductors (10) to plated through-holes (4) linking conductive tracks (6,7) at different layers of the circuit board (1).

公开(公告)号：AU571886B2

公开(公告)日：1988-04-28

申请号：AU3204684

申请日：1984-08-17

Applicant: INT COMPUTERS LTD

Inventor： THOMPSON GORDON LESLIE

IPC: H05K1/18 ,  H05K1/03 ,  H05K1/11 ,  H05K3/00 ,  H05K3/34 ,  H05K3/42 ,  H05K3/46

公开(公告)号：AU564420B2

公开(公告)日：1987-08-13

申请号：AU3204584

申请日：1984-08-17

Applicant: INT COMPUTERS LTD

Inventor： THOMPSON GORDON LESLIE ,  GUDGEON BRIAN ,  WOMBWELL KENNETH JAMES

IPC: H05K3/46 ,  H05K1/00 ,  H05K1/11 ,  H05K1/18 ,  H05K3/00 ,  H05K3/22 ,  H05K3/34 ,  H05K3/42

Abstract: A printed circuit board which facilitates the removal and replacement of components. The circuit board (1) has unplated holes (8) extending therethrough for receiving connection pins (3) of components (2) mounted on one face of the circuit board (1). The pins (3) protrude from the opposite face of the circuit board (1) and are soldered to conductive pads (9) on this face which are connected by surface conductors (10) to plated through-holes (4) linking conductive tracks (6,7) at different layers of the circuit board (1).

公开(公告)号：ZA8406089B

公开(公告)日：1985-03-27

申请号：ZA8406089

申请日：1984-08-06

Applicant: INT COMPUTERS LTD

Inventor： THOMPSON GORDON LESLIE

IPC: H05K1/18 ,  H05K1/03 ,  H05K1/11 ,  H05K3/00 ,  H05K3/34 ,  H05K3/42 ,  H05K3/46 ,  H05K

CPC classification number: H05K3/3447 ,  H05K1/116 ,  H05K3/0094 ,  H05K3/3452 ,  H05K3/429 ,  H05K3/4611 ,  H05K3/4688 ,  H05K2201/0154 ,  H05K2201/0949 ,  H05K2203/1394 ,  H05K2203/176

公开(公告)号：FR2550906A1

公开(公告)日：1985-02-22

申请号：FR8412980

申请日：1984-08-20

Applicant: INT COMPUTERS LTD

Inventor： THOMPSON GORDON LESLIE

IPC: H05K1/18 ,  H05K1/03 ,  H05K1/11 ,  H05K3/00 ,  H05K3/34 ,  H05K3/42 ,  H05K3/46

公开(公告)号：GB2145574B

公开(公告)日：1986-04-09

申请号：GB8421094

申请日：1984-08-20

Applicant: INT COMPUTERS LTD

Inventor： THOMPSON GORDON LESLIE

IPC: H05K1/18 ,  H05K1/03 ,  H05K1/11 ,  H05K3/00 ,  H05K3/34 ,  H05K3/42 ,  H05K3/46

公开(公告)号：ZA846089B

公开(公告)日：1985-03-27

申请号：ZA846089

申请日：1984-08-06

Applicant: INT COMPUTERS LTD

Inventor： THOMPSON GORDON LESLIE

IPC: H05K1/18 ,  H05K1/03 ,  H05K1/11 ,  H05K3/00 ,  H05K3/34 ,  H05K3/42 ,  H05K3/46 ,  H05K

公开(公告)号：GB2145574A

公开(公告)日：1985-03-27

申请号：GB8421094

申请日：1984-08-20

Applicant: INT COMPUTERS LTD

Inventor： THOMPSON GORDON LESLIE

IPC: H05K1/18 ,  H05K1/03 ,  H05K1/11 ,  H05K3/00 ,  H05K3/34 ,  H05K3/42 ,  H05K3/46

Abstract: A multilayer printed circuit board, in which the risk of damage during removal and replacement of components is reduced, is formed from layers of epoxy-glass carrying conductors (6,7). Connection pins (3) of components (2) mounted on a face of the circuit board (1) extend through holes (8) in the circuit board (1) and protrude from the opposite face. A polyimide-glass layer (13) covers the opposite face of the circuit board (1) and carries conductive pads (9) for connection to the ends of the pins (3) by means of solder (14). The polyimide-glass (13) has a higher transition temperature (260 DEG C-280 DEG C) than that of the epoxy-glass (120 DEG C) so that it suffers minimal loss of adhesion to the pads (9) at the temperature of the molten solder (220 DEG C-250 DEG C).

公开(公告)号：GB2134338A

公开(公告)日：1984-08-08

申请号：GB8401803

申请日：1984-01-24

Applicant: INT COMPUTERS LTD

Inventor： THOMPSON GORDON LESLIE

IPC: A63D15/00 ,  H05K3/30 ,  H05K3/34 ,  H01R4/02 ,  B23K1/12

Abstract: An integrated circuit package including a pin grid array is soldered to a printed circuit board (6). The tips (11) of the connection pins (5) of the circuit packages (1) protrude into plated- through holes (7) in the printed circuit board (6) and are soldered to the plated- through holes (7) at the side of the printed circuit board (6) adjacent the circuit package (2). The outer surface of the package (6) is preferably heated to melt solder positioned around the tips (11).