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公开(公告)号：AU564420B2
公开(公告)日：1987-08-13
申请号：AU3204584
申请日：1984-08-17
Applicant: INT COMPUTERS LTD
Inventor： THOMPSON GORDON LESLIE , GUDGEON BRIAN , WOMBWELL KENNETH JAMES
Abstract: A printed circuit board which facilitates the removal and replacement of components. The circuit board (1) has unplated holes (8) extending therethrough for receiving connection pins (3) of components (2) mounted on one face of the circuit board (1). The pins (3) protrude from the opposite face of the circuit board (1) and are soldered to conductive pads (9) on this face which are connected by surface conductors (10) to plated through-holes (4) linking conductive tracks (6,7) at different layers of the circuit board (1).
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公开(公告)号：FR2550905B1
公开(公告)日：1989-06-09
申请号：FR8412979
申请日：1984-08-20
Applicant: INT COMPUTERS LTD
Inventor： THOMPSON GORDON LESLIE , GUDGEON BRIAN , WOMBWELL KENNETH JAMES
IPC: H05K3/46 , H05K1/00 , H05K1/11 , H05K1/18 , H05K3/00 , H05K3/22 , H05K3/34 , H05K3/42 , H05K3/40
Abstract: A printed circuit board which facilitates the removal and replacement of components. The circuit board (1) has unplated holes (8) extending therethrough for receiving connection pins (3) of components (2) mounted on one face of the circuit board (1). The pins (3) protrude from the opposite face of the circuit board (1) and are soldered to conductive pads (9) on this face which are connected by surface conductors (10) to plated through-holes (4) linking conductive tracks (6,7) at different layers of the circuit board (1).
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公开(公告)号：DE3428811A1
公开(公告)日：1985-03-07
申请号：DE3428811
申请日：1984-08-04
Applicant: INT COMPUTERS LTD
Inventor： THOMPSON GORDON LESLIE , GUDGEON BRIAN , WOMBWELL KENNETH JAMES
IPC: H05K3/46 , H05K1/00 , H05K1/11 , H05K1/18 , H05K3/00 , H05K3/22 , H05K3/34 , H05K3/42 , H05K3/30
Abstract: A printed circuit board which facilitates the removal and replacement of components. The circuit board (1) has unplated holes (8) extending therethrough for receiving connection pins (3) of components (2) mounted on one face of the circuit board (1). The pins (3) protrude from the opposite face of the circuit board (1) and are soldered to conductive pads (9) on this face which are connected by surface conductors (10) to plated through-holes (4) linking conductive tracks (6,7) at different layers of the circuit board (1).
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Patent Agency Ranking
公开(公告)号：ZA846088B
公开(公告)日：1985-03-27
申请号：ZA846088
申请日：1984-08-06
Applicant: INT COMPUTERS LTD
Inventor： GUDGEON BRIAN , THOMPSON GORDON LESLIE , WOMBWELL KENNETH JAMES
Abstract: A printed circuit board which facilitates the removal and replacement of components. The circuit board (1) has unplated holes (8) extending therethrough for receiving connection pins (3) of components (2) mounted on one face of the circuit board (1). The pins (3) protrude from the opposite face of the circuit board (1) and are soldered to conductive pads (9) on this face which are connected by surface conductors (10) to plated through-holes (4) linking conductive tracks (6,7) at different layers of the circuit board (1).
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公开(公告)号：ZA8406088B
公开(公告)日：1985-03-27
申请号：ZA8406088
申请日：1984-08-06
Applicant: INT COMPUTERS LTD
Inventor： THOMPSON GORDON LESLIE , GUDGEON BRIAN , WOMBWELL KENNETH JAMES
CPC classification number: H05K3/0094 , H05K1/115 , H05K3/225 , H05K3/3447 , H05K3/3452 , H05K3/429 , H05K3/4676 , H05K3/4688 , H05K2201/0949 , H05K2201/09627 , H05K2203/1394 , H05K2203/176
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6.发明专利
公开(公告)号：GB2145573A
公开(公告)日：1985-03-27
申请号：GB8421093
申请日：1984-08-20
Applicant: INT COMPUTERS LTD
Inventor： THOMPSON GORDON LESLIE , GUDGEON BRIAN , WOMBWELL KENNETH JAMES
IPC: H05K3/46 , H05K1/00 , H05K1/11 , H05K1/18 , H05K3/00 , H05K3/22 , H05K3/34 , H05K3/42 , H05K1/03
Abstract: A printed circuit board which facilitates the removal and replacement of components. The circuit board (1) has unplated holes (8) extending therethrough for receiving connection pins (3) of components (2) mounted on one face of the circuit board (1). The pins (3) protrude from the opposite face of the circuit board (1) and are soldered to conductive pads (9) on this face which are connected by surface conductors (10) to plated through-holes (4) linking conductive tracks (6,7) at different layers of the circuit board (1).
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7.发明专利
公开(公告)号：GB2145573B
公开(公告)日：1986-04-09
申请号：GB8421093
申请日：1984-08-20
Applicant: INT COMPUTERS LTD
Inventor： THOMPSON GORDON LESLIE , GUDGEON BRIAN , WOMBWELL KENNETH JAMES
IPC: H05K3/46 , H05K1/00 , H05K1/11 , H05K1/18 , H05K3/00 , H05K3/22 , H05K3/34 , H05K3/42 , H05K1/03
Abstract: A printed circuit board which facilitates the removal and replacement of components. The circuit board (1) has unplated holes (8) extending therethrough for receiving connection pins (3) of components (2) mounted on one face of the circuit board (1). The pins (3) protrude from the opposite face of the circuit board (1) and are soldered to conductive pads (9) on this face which are connected by surface conductors (10) to plated through-holes (4) linking conductive tracks (6,7) at different layers of the circuit board (1).
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公开(公告)号：FR2550905A1
公开(公告)日：1985-02-22
申请号：FR8412979
申请日：1984-08-20
Applicant: INT COMPUTERS LTD
Inventor： THOMPSON GORDON LESLIE , GUDGEON BRIAN , WOMBWELL KENNETH JAMES
IPC: H05K3/46 , H05K1/00 , H05K1/11 , H05K1/18 , H05K3/00 , H05K3/22 , H05K3/34 , H05K3/42 , H05K3/40
Abstract: A printed circuit board which facilitates the removal and replacement of components. The circuit board (1) has unplated holes (8) extending therethrough for receiving connection pins (3) of components (2) mounted on one face of the circuit board (1). The pins (3) protrude from the opposite face of the circuit board (1) and are soldered to conductive pads (9) on this face which are connected by surface conductors (10) to plated through-holes (4) linking conductive tracks (6,7) at different layers of the circuit board (1).
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