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公开(公告)号：US3745095A
公开(公告)日：1973-07-10
申请号：US3745095D
申请日：1971-01-26
Applicant: INT ELECTRONIC RES CORP
Inventor： CHADWICK D , MUELLER W , APODACA R
IPC: H05K1/05 , H05K3/06 , H05K3/10 , H05K3/18 , H05K3/24 , H05K3/38 , H05K3/42 , H05K3/44 , C23B5/48
CPC classification number: H05K3/24 , H05K1/056 , H05K3/062 , H05K3/108 , H05K3/181 , H05K3/381 , H05K3/426 , H05K3/445 , H05K2201/0209 , H05K2201/0344 , H05K2203/025 , H05K2203/1105
Abstract: The invention is a method for making a metal core printed circuit board which includes applying multiple layers of synthetic plastic resin material to a sheet of metal, then treating the surface of the plastic material in such a way as to provide an acceptable bond, followed by applying sundry layers of different metals, first to the plastic surface and then one upon another followed by the imposition of a circuit pattern, the removal of materials from areas intermediate the circuit pattern, and the application of an appropriate overlay of unlike metal to the circuit pattern, thereby to provide a finished circuit board.
Abstract translation: 本发明是一种用于制造金属芯印刷电路板的方法，其包括将多层合成塑料树脂材料施加到金属片上，然后以提供可接受的粘合剂的方式处理塑料材料的表面，接着是 应用各种不同金属层，首先到塑料表面，然后一个接一个地接着施加电路图案，从电路图案之间的区域去除材料，以及将不同于金属的合适覆盖层施加到电路 图案，从而提供成品电路板。
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公开(公告)号：CA932480A
公开(公告)日：1973-08-21
申请号：CA116582
申请日：1971-06-24
Applicant: INT ELECTRONIC RES CORP
Inventor： MUELLER W , APODACA R , CHADWICK D
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公开(公告)号：CA930072A
公开(公告)日：1973-07-10
申请号：CA66390
申请日：1969-10-31
Applicant: INT ELECTRONIC RES CORP
Inventor： APODACA R , CHADWICK D
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