公开(公告)号：WO2004001102A1

公开(公告)日：2003-12-31

申请号：PCT/CA2003/000397

申请日：2003-03-20

Applicant: INTEGRAN TECHNOLOGIES INC.

Inventor： PALUMBO, Gino ,  BROOKS, Iain ,  ROBERTSON, J. ,  PANAGIOTOPOULOS, Konstantinos ,  GONZALEZ, Francisco ,  TOMANTSCHGER, Klaus

IPC: C25D5/02

CPC classification number: C25D5/02 ,  C25D5/06 ,  C25D5/18 ,  C25D7/04

Abstract: A process for in situ electroforming a structural reinforcing layer of selected metallic material for repairing an external surface area of a degraded section of metallic workpieces, especially of tubes and tube sections, is described. Preferably, the metal layer coatings are made of fine-grained metals, metal alloys or metal matrix composites. The plating system can be used on straight tubes, tube joints to different diameter tubes or face plates, tube elbows and other complex shapes encountered in piping systems. A suitable apparatus is assembled on or near the degraded site and is sealed in place to form the plating cell. Also described is a process for plating "patches" onto degraded areas by selective plating including brush plating.

Abstract translation: 描述了一种用于原位电铸选择的金属材料的结构增强层的方法，用于修复金属工件的退化部分，特别是管和管部分的退化部分的外表面区域。 优选地，金属层涂层由细粒金属，金属合金或金属基质复合材料制成。 电镀系统可用于直管，管接头到不同直径的管或面板，管弯头和管道系统中遇到的其他复杂形状。 将合适的装置组装在退化位置上或附近，并将其密封在适当位置以形成电镀槽。 还描述了通过包括刷镀的选择性电镀将“贴剂”电镀到降解区域上的方法。