公开(公告)号：JP2004047993A

公开(公告)日：2004-02-12

申请号：JP2003173074

申请日：2003-06-18

Applicant: Intel Corp ,  インテル コーポレイション

Inventor： MA QING ,  CHOU TSUNG-KUAN ALLEN

IPC: B81C1/00 ,  B81B7/00 ,  B81B7/02 ,  H01L21/3205 ,  H01L21/768 ,  H01L21/822 ,  H01L23/52 ,  H01L23/522 ,  H01L23/66 ,  H01L27/04

CPC classification number: H01L23/66 ,  B81B7/0006 ,  H01L23/5221 ,  H01L2924/0002 ,  H01L2924/00

Abstract: PROBLEM TO BE SOLVED: To provide a better method for connection in an MEMS device.
SOLUTION: The method comprises a step for forming a pair of first and second conductive strips (earthing wires 12a) separated from each other by a gap in a first conductive layer (bottom conductive layer 12); a step for forming a conductor (control voltage line 18) extending through the gap 22 in the first conductive layer; and a step for forming a conductive bridge 16e electrically connecting the first and second conductive strips to each other while being insulated from the conductor 18 in a second conductive layer (top conductive layer).
COPYRIGHT: (C)2004,JPO

公开(公告)号：GB2453283A

公开(公告)日：2009-04-01

申请号：GB0822743

申请日：2007-06-26

Applicant: INTEL CORP

Inventor： MA QING ,  CHOU TSUNG-KUAN ALLEN

IPC: H01L45/00 ,  B81B3/00 ,  G11C16/02 ,  H01L21/8247 ,  H01L27/108 ,  H01L27/115 ,  H01L27/24

Abstract: An apparatus comprising a substrate, a heater formed on the substrate, and a phase-change layer formed on the heater. The heater comprises a heater layer and first and second electrodes electrically coupled to the heater layer. A process comprising forming a heater on a substrate and forming a phase-change layer on the heater. The heater comprises a heater layer and first and second electrodes electrically coupled to the heater layer.

公开(公告)号：GB2392011B

公开(公告)日：2006-08-23

申请号：GB0314179

申请日：2003-06-18

Applicant: INTEL CORP

Inventor： QING MA ,  CHOU TSUNG-KUAN ALLEN

IPC: B81C1/00 ,  H01L23/522 ,  B81B7/00 ,  B81B7/02 ,  H01L21/3205 ,  H01L21/768 ,  H01L21/822 ,  H01L23/52 ,  H01L23/66 ,  H01L27/04

Abstract: A conductive bridge (16) in a second conductive layer may be utilized to join a pair of spaced apart conductive strips (12) in a first conductive layer. A gap (44) between the first and second strips (12) may be bridged by the bridge (16) while isolating both the first and second strips (12) and the bridge (16) itself from another conductor (18) which extends through the gap (44) between the first and second strips (12).

公开(公告)号：AU2003300809A1

公开(公告)日：2004-07-29

申请号：AU2003300809

申请日：2003-12-03

Applicant: INTEL CORP

Inventor： TRAN QUAN ,  MA QING ,  HAYDEN JOSEPH III ,  CHOU TSUNG-KUAN ALLEN

IPC: H01P3/00 ,  H01P11/00 ,  H05K1/02 ,  H05K3/24

Abstract: Coplanar waveguides have a center signal line and a pair of ground lines on either side formed of a sputtered material such as gold (Au). Such waveguides are subject to what is known as the edge effect at high frequency operation causing currents to concentrate and flow along adjacent edges of the lines. Providing a thicker plated layer only on adjacent edges of the lines provide substantial performance improvements over sputtered lines alone while saving significant amount of Au, thus reducing costs.

公开(公告)号：GB2392011A

公开(公告)日：2004-02-18

申请号：GB0314179

申请日：2003-06-18

Applicant: INTEL CORP

Inventor： QING MA ,  CHOU TSUNG-KUAN ALLEN

IPC: B81C1/00 ,  B81B7/00 ,  B81B7/02 ,  H01L21/3205 ,  H01L21/768 ,  H01L21/822 ,  H01L23/52 ,  H01L23/522 ,  H01L23/66 ,  H01L27/04 ,  H01L23/482 ,  H01L21/764

Abstract: Conductive strips 12 in a first conductive layer are spaced apart by gap (fig 5: 44). A conductive bridge 16 in a second conductive layer is used to bridge the gap, while isolating the strips and the bridge from another conductor within the first conductive layer (fig 1: 18) which extends through the gap. A sacrificial layer under the bridge may be removed. In one embodiment (fig 1), a co-planar waveguide includes a control voltage line (18) routed under a bridge (16e) across ground line (12a) pair separated by gap (22). In another embodiment (fig 2) a multiplexer (10a) has a voltage line (18a) which spans through three separate ground lines (12a, 12b and 12c) under bridges (20, 20a and 26) between conductor pairs, to reach ground line (12d).

公开(公告)号：DE10326555B4

公开(公告)日：2009-09-24

申请号：DE10326555

申请日：2003-06-12

Applicant: INTEL CORP

Inventor： MA QING ,  CHOU TSUNG-KUAN ALLEN

IPC: B81C1/00 ,  H01L21/768 ,  B81B7/00 ,  B81B7/02 ,  H01L21/3205 ,  H01L21/822 ,  H01L23/52 ,  H01L23/522 ,  H01L23/535 ,  H01L23/66 ,  H01L27/04

Abstract: A conductive bridge (16) in a second conductive layer may be utilized to join a pair of spaced apart conductive strips (12) in a first conductive layer. A gap (44) between the first and second strips (12) may be bridged by the bridge (16) while isolating both the first and second strips (12) and the bridge (16) itself from another conductor (18) which extends through the gap (44) between the first and second strips (12).

公开(公告)号：GB2422720A

公开(公告)日：2006-08-02

申请号：GB0518966

申请日：2003-06-18

Applicant: INTEL CORP

Inventor： MA QING ,  CHOU TSUNG-KUAN ALLEN

IPC: B81C1/00 ,  H01L23/522 ,  B81B7/00 ,  B81B7/02 ,  H01L21/3205 ,  H01L21/768 ,  H01L21/822 ,  H01L23/52 ,  H01L23/66 ,  H01L27/04

Abstract: A conductive bridge 16 in a second conductive layer electrically connects a pair of spaced apart conductive strips 12 in a first conductive layer. A gap (44, fig 4) between the conductive strips 12 is spanned by the bridge 16 while isolating the conductive strips and the bridge from a conducting line (46, fig 4) extending through the gap (44). Preferably the bridge is formed over a sacrificial polymeric material (48, fig 10) which is subsequently removed by heating to leave an airgap 58 between the bridge 16 and the conducting line (46). The system can be used to route a control voltage line (18a, fig 2) through gaps in multiple ground lines (12a, 12b, 12c fig 2) where each gap is spanned by a conductive bridge (20, 20a fig 2).

公开(公告)号：DE10326555A1

公开(公告)日：2004-01-22

申请号：DE10326555

申请日：2003-06-12

Applicant: INTEL CORP

Inventor： MA QING ,  CHOU TSUNG-KUAN ALLEN

IPC: B81C1/00 ,  B81B7/00 ,  B81B7/02 ,  H01L21/3205 ,  H01L21/768 ,  H01L21/822 ,  H01L23/52 ,  H01L23/522 ,  H01L23/66 ,  H01L27/04 ,  H01L23/535

Abstract: A conductive bridge (16) in a second conductive layer may be utilized to join a pair of spaced apart conductive strips (12) in a first conductive layer. A gap (44) between the first and second strips (12) may be bridged by the bridge (16) while isolating both the first and second strips (12) and the bridge (16) itself from another conductor (18) which extends through the gap (44) between the first and second strips (12).

公开(公告)号：GB2453283B

公开(公告)日：2012-01-11

申请号：GB0822743

申请日：2007-06-26

Applicant: INTEL CORP

Inventor： MA QING ,  CHOU TSUNG-KUAN ALLEN ,  RAO VALLURI R

IPC: H01L45/00 ,  B81B3/00 ,  G11C16/02 ,  H01L21/8247 ,  H01L27/108 ,  H01L27/115 ,  H01L27/24

Abstract: An apparatus comprising a substrate, a heater formed on the substrate, and a phase-change layer formed on the heater. The heater comprises a heater layer and first and second electrodes electrically coupled to the heater layer. A process comprising forming a heater on a substrate and forming a phase-change layer on the heater. The heater comprises a heater layer and first and second electrodes electrically coupled to the heater layer.

公开(公告)号：MY134508A

公开(公告)日：2007-12-31

申请号：MYPI20032216

申请日：2003-06-13

Applicant: INTEL CORP

Inventor： MA QING ,  CHOU TSUNG-KUAN ALLEN

IPC: B81C1/00 ,  H01P5/12 ,  B81B7/00 ,  B81B7/02 ,  H01L21/3205 ,  H01L21/768 ,  H01L21/822 ,  H01L23/52 ,  H01L23/522 ,  H01L23/66 ,  H01L27/04

Abstract: A CONDUCTIVE BRIDGE (16) IN A SECOND CONDUCTIVE LAYER MAY BE UTILIZED TO JOIN A PAIR OF SPACED APART CONDUCTIVE STRIPS (12) IN A FIRST CONDUCTIVE LAYER. A GAP (44) BETWEEN THE FIRST AND SECOND STRIPS (12) MAY BE BRIDGED BY THE BRIDGE (16) WHILE ISOLATING BOTH THE FIRST AND SECOND STRIPS (12) AND THE BRIDGE (16) ITSELF FROM ANOTHER CONDUCTOR (18) WHICH EXTENDS THROUGH THE GAP (44) BETWEEN THE FIRST AND SECOND STRIPS (12).(FIG 1)