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1.HYBRID INTEGRATION OF GROUP III-V SEMICONDUCTOR DEVICES ON SILICON 审中-公开
Title translation: 硅的III-V族半导体元件的混合集成公开(公告)号:EP2795675A4
公开(公告)日:2015-11-25
申请号:EP11878060
申请日:2011-12-20
Applicant: INTEL CORP
Inventor: HECK JOHN , BAR HANAN , FESHALI AVI , FELDESH RAN
CPC classification number: G02B6/1225 , G02B6/12004 , G02B6/13 , G02B2006/12061 , H01L21/28575 , H01L21/8252 , H01L21/8258 , H01L21/84 , H01L27/1203 , H01L29/205