公开(公告)号：AT414992T

公开(公告)日：2008-12-15

申请号：AT03787126

申请日：2003-11-24

Applicant: INTEL CORP

Inventor： KIM SARAH ,  LIST R ,  MAVEETY JAMES ,  MYERS ALAN ,  VU QUAT ,  PRASHER RAVI ,  MAHAJAN RAVINDRANATH

IPC: H01L23/473 ,  F04B19/00

Abstract: The present disclosure relates generally to microelectronic technology, and more specifically, to an apparatus used for the cooling of active electronic devices utilizing electro-osmotic pumps and micro-channels.

公开(公告)号：WO0227788A2

公开(公告)日：2002-04-04

申请号：PCT/US0130157

申请日：2001-09-25

Applicant: INTEL CORP ,  MA QING ,  MAVEETY JAMES ,  TRAN QUAN

Inventor： MA QING ,  MAVEETY JAMES ,  TRAN QUAN

IPC: H01L23/36 ,  H01L23/367

CPC classification number: H01L23/36 ,  H01L23/3677 ,  H01L2224/16225 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2924/10253 ,  H01L2924/15151 ,  H01L2924/16151 ,  H01L2924/00 ,  H01L2224/0401

Abstract: A microelectronic die is aligned with a package substrate and attached to it using solder balls. A specially shaped heat spreader, preferably with a coefficient of thermal expansion (CTE) similar to that of silicon, is attached to the back side of the die using a heat-conducting adhesive. An epoxy-based material is flowed into the gap between the die, the substrate, and the heat spreader via a through-hole in either the substrate or the heat spreader using a dispense process or a transfer molding process. By positioning the heat spreader to abut the die corners and/or edges, the stresses on the die are substantially reduced or eliminated.

Abstract translation: 微电子管芯与封装衬底对准并使用焊球附着于其上。 使用导热粘合剂将特定形状的散热器（优选地具有与硅的热膨胀系数（CTE）相似的热膨胀系数（CTE））附接到管芯的背面。 使用分配过程或传递模塑过程，基于环氧树脂的材料经由基板或散热器中的通孔流入管芯，基板和散热器之间的间隙中。 通过将散热器定位成邻接模具拐角和/或边缘，模具上的应力被显着减小或消除。

公开(公告)号：DE102007029378B4

公开(公告)日：2010-08-19

申请号：DE102007029378

申请日：2007-06-26

Applicant: INTEL CORP

Inventor： MOSLEY LARRY ,  MAVEETY JAMES ,  HUA FAY

IPC: H01L21/58 ,  C08L101/12 ,  H01B1/12 ,  H01L23/498 ,  H01L23/50

公开(公告)号：DE60324836D1

公开(公告)日：2009-01-02

申请号：DE60324836

申请日：2003-11-24

Applicant: INTEL CORP

Inventor： KIM SARAH ,  LIST R SCOTT ,  MAVEETY JAMES ,  MYERS ALAN ,  VU QUAT ,  PRASHER RAVI ,  MAHAJAN RAVINDRANATH

IPC: H01L23/473 ,  F04B19/00

Abstract: The present disclosure relates generally to microelectronic technology, and more specifically, to an apparatus used for the cooling of active electronic devices utilizing electro-osmotic pumps and micro-channels.

公开(公告)号：HK1076541A1

公开(公告)日：2006-01-20

申请号：HK05108353

申请日：2005-09-22

Applicant: INTEL CORP

Inventor： KIM SARAH ,  LIST R SCOTT ,  MAVEETY JAMES ,  MYERS ALAN ,  VU QUAT ,  PRASHER RAVI ,  MAHAJAN RAVINDRANATH

IPC: F04B20090101 ,  F04B19/00 ,  H01L20090101 ,  H01L23/473

Abstract: The present disclosure relates generally to microelectronic technology, and more specifically, to an apparatus used for the cooling of active electronic devices utilizing electro-osmotic pumps and micro-channels.

公开(公告)号：DE102007029378A1

公开(公告)日：2008-01-31

申请号：DE102007029378

申请日：2007-06-26

Applicant: INTEL CORP

Inventor： MOSLEY LARRY ,  MAVEETY JAMES ,  HUA FAY

IPC: H01L21/58 ,  C08L101/12 ,  H01B1/12 ,  H01L23/498 ,  H01L23/50

公开(公告)号：AU2003295912A1

公开(公告)日：2004-07-29

申请号：AU2003295912

申请日：2003-11-24

Applicant: INTEL CORP

Inventor： KIM SARAH ,  LIST R SCOTT ,  MAVEETY JAMES ,  MYERS ALAN ,  VU QUAT ,  PRASHER RAVI ,  MAHAJAN RAVINDRANATH

IPC: F04B19/00 ,  H01L23/473

Abstract: The present disclosure relates generally to microelectronic technology, and more specifically, to an apparatus used for the cooling of active electronic devices utilizing electro-osmotic pumps and micro-channels.

公开(公告)号：AU9633201A

公开(公告)日：2002-04-08

申请号：AU9633201

申请日：2001-09-25

Applicant: INTEL CORP

Inventor： MA QING ,  MAVEETY JAMES ,  TRAN QUAN

IPC: H01L23/36 ,  H01L23/367

Abstract: A microelectronic die is aligned with a package substrate and attached to it using solder balls. A specially shaped heat spreader, preferably with a coefficient of thermal expansion (CTE) similar to that of silicon, is attached to the back side of the die using a heat-conducting adhesive. An epoxy-based material is flowed into the gap between the die, the substrate, and the heat spreader via a through-hole in either the substrate or the heat spreader using a dispense process or a transfer molding process. By positioning the heat spreader to abut the die corners and/or edges, the stresses on the die are substantially reduced or eliminated.