公开(公告)号：AU2003302851A1

公开(公告)日：2004-06-30

申请号：AU2003302851

申请日：2003-10-27

Applicant: INTEL CORP

Inventor： GUZEK JOHN ,  AZIMI HAMID ,  WOOD DUSTIN ,  MOBLEY WASHINGTON

IPC: H01L23/14 ,  H01L23/498 ,  H05K1/05 ,  H05K3/44 ,  H05K3/46 ,  H01L21/768 ,  H01L23/522

Abstract: Apparatus and methods are provided for a rigid metal core carrier substrate. The metal core increases the modulus of elasticity of the carrier substrate to greater than 20 GPa to better resist bending loads and stresses encountered during assembly, testing and consumer handling. The carrier substrate negates the need to provide external stiffening members resulting in a microelectronic package of reduced size and complexity. The coefficient of thermal expansion of the carrier substrate can be adapted to more closely match that of the microelectronic die, providing a device more resistant to thermally-induced stresses. In one embodiment of the method in accordance with the invention, a metal sheet having a thickness in the range including 200-500 mum and a flexural modulus of elasticity of at least 20 GPa is laminated on both sides with dielectric and conductive materials using standard processing technologies to create a carrier substrate.