公开(公告)号：AU2003299597A8

公开(公告)日：2004-07-29

申请号：AU2003299597

申请日：2003-12-08

Applicant: INTEL CORP

Inventor： OSBURN EDWARD

IPC: H01L21/44 ,  H01L23/498 ,  H01L23/50 ,  H01L27/10 ,  H05K1/02 ,  H05K1/11 ,  H05K3/42

Abstract: A method and an apparatus for improving the delivery and filtering of power to a semiconductor device is disclosed by organizing out interconnects (pins, balls, pads or other interconnects) used to carry power in a striped configuration that shortens the conductive path required between a power source and a semiconductor device and that reduces the resistance of that conductive path.

公开(公告)号：AU2003272621A8

公开(公告)日：2004-04-23

申请号：AU2003272621

申请日：2003-09-19

Applicant: INTEL CORP

Inventor： OSBURN EDWARD ,  PETER ERIK ,  GATES TIMOTHY

IPC: H01L23/498 ,  H01L23/50 ,  H05K1/02 ,  H05K1/11 ,  H05K3/42

Abstract: A method and an apparatus for improving the delivery and filtering of power to a semiconductor device is disclosed by organizing out interconnects (pins, balls, pads or other interconnects) used to carry power in a striped configuration that shortens the conductive path required between a power source and a semiconductor device and that reduces the resistance of that conductive path.

公开(公告)号：WO2004061960A3

公开(公告)日：2005-01-27

申请号：PCT/US0339194

申请日：2003-12-08

Applicant: INTEL CORP

Inventor： OSBURN EDWARD

IPC: H01L21/44 ,  H01L23/498 ,  H01L23/50 ,  H01L27/10 ,  H05K1/02 ,  H05K1/11 ,  H05K3/42

CPC classification number: H05K1/0262 ,  H01L23/49838 ,  H01L23/50 ,  H01L2924/0002 ,  H05K1/0219 ,  H05K1/0231 ,  H05K1/0263 ,  H05K1/112 ,  H05K3/429 ,  H05K2201/093 ,  H05K2201/1003 ,  H05K2201/10515 ,  H05K2201/10545 ,  H05K2201/10704 ,  H05K2201/10734 ,  H01L2924/00

Abstract: A method and an apparatus for improving the delivery and filtering of power to a semiconductor device is disclosed by organizing out interconnects (pins, balls, pads or other interconnects) used to carry power in a striped configuration that shortens the conductive path required between a power source and a semiconductor device and that reduces the resistance of that conductive path.

Abstract translation: 公开了一种用于改进对半导体器件的功率的传递和滤波的方法和装置，其通过组织用于以条形配置携带功率的互连（引脚，球，焊盘或其他互连），其缩短了功率之间所需的导电路径 源极和半导体器件，并且降低该导电路径的电阻。

公开(公告)号：WO2004032234A3

公开(公告)日：2004-10-14

申请号：PCT/US0329767

申请日：2003-09-19

Applicant: INTEL CORP

Inventor： OSBURN EDWARD ,  PETER ERIK ,  GATES TIMOTHY

IPC: H01L23/498 ,  H01L23/50 ,  H05K1/02 ,  H05K1/11 ,  H05K3/42

CPC classification number: H05K1/0262 ,  H01L23/49838 ,  H01L23/50 ,  H01L2924/0002 ,  H05K1/0219 ,  H05K1/0231 ,  H05K1/0263 ,  H05K1/112 ,  H05K3/429 ,  H05K2201/093 ,  H05K2201/1003 ,  H05K2201/10515 ,  H05K2201/10545 ,  H05K2201/10704 ,  H05K2201/10734 ,  H01L2924/00

Abstract: A method and an apparatus for improving the delivery and filtering of power to a semiconductor device is disclosed by organizing out interconnects (pins, balls, pads or other interconnects) used to carry power in a striped configuration that shortens the conductive path required between a power source and a semiconductor device and that reduces the resistance of that conductive path.

Abstract translation: 本发明公开了一种用于改善向半导体器件的功率的传递和过滤的方法和设备，其通过组织用于以条形配置承载功率的互连（引脚，球，焊盘或其他互连），以缩短功率之间所需的导电路径 源和半导体器件，并且减小该导电路径的电阻。

公开(公告)号：AU2003299597A1

公开(公告)日：2004-07-29

申请号：AU2003299597

申请日：2003-12-08

Applicant: INTEL CORP

Inventor： OSBURN EDWARD

IPC: H01L21/44 ,  H01L23/498 ,  H01L23/50 ,  H01L27/10 ,  H05K1/02 ,  H05K1/11 ,  H05K3/42

Abstract: A method and an apparatus for improving the delivery and filtering of power to a semiconductor device is disclosed by organizing out interconnects (pins, balls, pads or other interconnects) used to carry power in a striped configuration that shortens the conductive path required between a power source and a semiconductor device and that reduces the resistance of that conductive path.

公开(公告)号：AU2003272621A1

公开(公告)日：2004-04-23

申请号：AU2003272621

申请日：2003-09-19

Applicant: INTEL CORP

Inventor： OSBURN EDWARD ,  PETER ERIK ,  GATES TIMOTHY

IPC: H01L23/498 ,  H01L23/50 ,  H05K1/02 ,  H05K1/11 ,  H05K3/42

Abstract: A method and an apparatus for improving the delivery and filtering of power to a semiconductor device is disclosed by organizing out interconnects (pins, balls, pads or other interconnects) used to carry power in a striped configuration that shortens the conductive path required between a power source and a semiconductor device and that reduces the resistance of that conductive path.

公开(公告)号：DE112005001686T5

公开(公告)日：2007-06-06

申请号：DE112005001686

申请日：2005-07-08

Applicant: INTEL CORP

Inventor： SEARLS DAMION ,  OSBURN EDWARD

IPC: H05K1/02 ,  H05K1/18

Abstract: In one embodiment, the present invention includes a semiconductor device mounted to a first side of a circuit board; and at least one voltage regulator device mounted to a second side of the circuit board, the second side opposite to the first side. Examples of the voltage regulator devices include output filters, inductors, capacitors, and the like. In certain embodiments, the devices may be located directly underneath the semiconductor device.