公开(公告)号：WO0211504A2

公开(公告)日：2002-02-07

申请号：PCT/US0122960

申请日：2001-07-20

Applicant: INTEL CORP

Inventor： CHIU CHIA-PIN ,  SOLBREKKEN GARY ,  SIMMONS CRAIG

IPC: H05K7/20 ,  H05K7/00

CPC classification number: H01L23/433 ,  H01L23/3733 ,  H01L23/4275 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/16195 ,  H01L2224/05599

Abstract: A thermal interface comprising a grid frame having a thermally conductive interface material coated thereon. The thermal interface is disposed between a heat source and a heat dissipation device wherein the thermally conductive material preferably melts at a temperature at or below the temperature of the heat source.

Abstract translation: 包括网格框架的热界面，所述网格框架上涂覆有导热界面材料。 热界面设置在热源和散热装置之间，其中导热材料优选在等于或低于热源温度的温度下熔化。

公开(公告)号：AU7705101A

公开(公告)日：2002-02-13

申请号：AU7705101

申请日：2001-07-20

Applicant: INTEL CORP

Inventor： CHIU CHIA-PIN ,  SOLBREKKEN GARY ,  SIMMONS CRAIG

IPC: H05K7/20 ,  H05K7/00

Abstract: A thermal interface comprising a grid frame having a thermally conductive interface material coated thereon. The thermal interface is disposed between a heat source and a heat dissipation device wherein the thermally conductive material preferably melts at a temperature at or below the temperature of the heat source.