公开(公告)号：AU2025499A

公开(公告)日：1999-08-23

申请号：AU2025499

申请日：1999-01-04

Applicant: INTEL CORP

Inventor： CHIU CHIA-PIN ,  YUSUF IMRAN ,  KOUSHIK BANERJEE ,  YOUNG TODD ,  SOLBREKKEN GARY

IPC: H01L29/40 ,  H01L23/36 ,  H01L23/367 ,  H01L23/40 ,  H01L25/065 ,  H01L25/07 ,  H01L25/18 ,  H05K7/20 ,  H01L23/10 ,  H01L23/34 ,  H01L23/48 ,  H01L23/52

Abstract: One embodiment of the present invention is an electronic assembly which may have a first integrated circuit package mounted to a first side of a substrate and a second integrated circuit package mounted to a second side of the substrate. A thermal plate may be thermally coupled to the first integrated circuit package. A heat sink may be mounted to the thermal plate. A thermal bus may be is thermally coupled to the second integrated circuit package and the thermal plate. The thermal bus bar allows heat to flow from the second integrated circuit package to the thermal plate and heat sink. The electronic assembly of the present invention can thus remove heat from integrated circuit packages located on both sides of a substrate with only one heat sink.

公开(公告)号：WO0211504A2

公开(公告)日：2002-02-07

申请号：PCT/US0122960

申请日：2001-07-20

Applicant: INTEL CORP

Inventor： CHIU CHIA-PIN ,  SOLBREKKEN GARY ,  SIMMONS CRAIG

IPC: H05K7/20 ,  H05K7/00

CPC classification number: H01L23/433 ,  H01L23/3733 ,  H01L23/4275 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/16195 ,  H01L2224/05599

Abstract: A thermal interface comprising a grid frame having a thermally conductive interface material coated thereon. The thermal interface is disposed between a heat source and a heat dissipation device wherein the thermally conductive material preferably melts at a temperature at or below the temperature of the heat source.

Abstract translation: 包括网格框架的热界面，所述网格框架上涂覆有导热界面材料。 热界面设置在热源和散热装置之间，其中导热材料优选在等于或低于热源温度的温度下熔化。

公开(公告)号：AU7705101A

公开(公告)日：2002-02-13

申请号：AU7705101

申请日：2001-07-20

Applicant: INTEL CORP

Inventor： CHIU CHIA-PIN ,  SOLBREKKEN GARY ,  SIMMONS CRAIG

IPC: H05K7/20 ,  H05K7/00

Abstract: A thermal interface comprising a grid frame having a thermally conductive interface material coated thereon. The thermal interface is disposed between a heat source and a heat dissipation device wherein the thermally conductive material preferably melts at a temperature at or below the temperature of the heat source.