公开(公告)号：WO0249103A3

公开(公告)日：2003-09-18

申请号：PCT/US0144968

申请日：2001-11-15

Applicant: INTEL CORP ,  WERMER PAUL H ,  TOWLE STEVEN N

Inventor： WERMER PAUL H ,  TOWLE STEVEN N

IPC: H01L23/12 ,  H01L21/56 ,  H01L21/68 ,  H01L23/538 ,  H05K1/18 ,  H05K3/46 ,  H01L21/60 ,  H01L23/36 ,  H01L23/498

CPC classification number: H01L21/568 ,  H01L23/142 ,  H01L23/49816 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/24 ,  H01L24/96 ,  H01L24/97 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/20 ,  H01L2224/24227 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2224/92244 ,  H01L2224/97 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01051 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15311 ,  H01L2924/18162 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30107 ,  H05K1/185 ,  H05K3/4614 ,  H01L2924/00

Abstract: A microelectronic device fabrication technology that places at least one microelectronic die within at least one opening in a microelectronic package core and secures the microelectronic die/dice within the openings(s) with an encapsulation material, that encapsulates at least one microelectronic die within an encapsulation material without a microelectronic package core, or that secures at least one microelectronic die within at least one opening in a heat spreader. A laminated interconnector of dieelectric materials and conductive traces is then attached to the microelectronic die/dice and at least one of following: the encapsulation material, the microelectronic package core, and the heat spreader, to form a microelectronic device.

Abstract translation: 一种微电子器件制造技术，其将至少一个微电子管芯放置在微电子封装芯内的至少一个开口内，并用封装材料将微电子管芯/裸片固定在开口内，该封装材料将至少一个微电子管芯封装在封装 没有微电子封装芯的材料，或者在散热器的至少一个开口内固定至少一个微电子管芯。 然后，将一个层压互连器件的电介质材料和导电迹线附着到微电子管芯/裸片上，以及至少一个：封装材料，微电子封装芯和散热器，以形成微电子器件。

公开(公告)号：WO0247162A3

公开(公告)日：2003-08-07

申请号：PCT/US0149898

申请日：2001-11-09

Applicant: INTEL CORP ,  HENAO MARIA V ,  MU XIAO-CHUN ,  MA QING ,  VU QUAT T ,  TOWLE STEVEN N

Inventor： HENAO MARIA V ,  MU XIAO-CHUN ,  MA QING ,  VU QUAT T ,  TOWLE STEVEN N

IPC: H01L23/12 ,  H01L21/56 ,  H01L23/16 ,  H01L23/31 ,  H01L23/433 ,  H01L23/538 ,  H01L25/04 ,  H01L25/18

CPC classification number: H01L24/20 ,  H01L21/561 ,  H01L23/16 ,  H01L23/3128 ,  H01L23/4334 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/97 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16225 ,  H01L2224/20 ,  H01L2224/24227 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2224/92244 ,  H01L2224/97 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01061 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2224/82 ,  H01L2924/00

Abstract: A microelectronic package fabrication technology that attaches at least one microelectronic die onto a heat spreader and encepsulates the microelectronic die/dice thereon which may further include a microelectronic packaging core abutting the heat spreader wherein the microelectronic die/dice reside within at least one opening in a microelectronic package core. After encapsulation, build-up layers may be fabricated to form electrical connections with the microelectronic die/dice.

Abstract translation: 一种微电子封装制造技术，其将至少一个微电子管芯附接到散热器上并嵌入其上的微电子管芯/裸片，其可进一步包括邻接散热器的微电子封装芯，其中微电子管芯/裸片位于至少一个开口中 微电子封装核心。 在封装之后，可以制造堆积层以形成与微电子管芯/裸片的电连接。

公开(公告)号：AU2002258423A1

公开(公告)日：2002-10-08

申请号：AU2002258423

申请日：2002-03-01

Applicant: INTEL CORP

Inventor： CUENDET JOHN S ,  JOHNSON KYLE T ,  TOWLE STEVEN N

IPC: H01L23/12 ,  H01L21/56 ,  H01L21/68 ,  H01L23/16 ,  H01L23/31 ,  H01L23/538

Abstract: A microelectronic package including at least one microelectronic die disposed within an opening in a microelectronic package core, wherein a liquid encapsulation material is injected with a dispensing needle within portions of the opening not occupied by the microelectronic dice. The encapsulation material is cure thereafter. Interconnection layers of dielectric materials and conductive traces are then fabricated on the microelectronic die, the encapsulation material, and the microelectronic package core to form the microelectronic package.

公开(公告)号：AU1997202A

公开(公告)日：2002-06-24

申请号：AU1997202

申请日：2001-11-15

Applicant: INTEL CORP

Inventor： WERMER PAUL H ,  TOWLE STEVEN N

IPC: H01L23/12 ,  H01L21/56 ,  H01L21/68 ,  H01L23/538 ,  H05K1/18 ,  H05K3/46 ,  H01L23/498

Abstract: A microelectronic device fabrication technology that places at least one microelectronic die within at least one opening in a microelectronic package core and secures the microelectronic die/dice within the openings(s) with an encapsulation material, that encapsulates at least one microelectronic die within an encapsulation material without a microelectronic package core, or that secures at least one microelectronic die within at least one opening in a heat spreader. A laminated interconnector of dieelectric materials and conductive traces is then attached to the microelectronic die/dice and at least one of following: the encapsulation material, the microelectronic package core, and the heat spreader, to form a microelectronic device.

公开(公告)号：AU3274702A

公开(公告)日：2002-06-18

申请号：AU3274702

申请日：2001-11-09

Applicant: INTEL CORP

Inventor： HENAO MARIA V ,  MU XIAO-CHUN ,  MA QING ,  VU QUAT T ,  TOWLE STEVEN N

IPC: H01L23/12 ,  H01L21/56 ,  H01L23/16 ,  H01L23/31 ,  H01L23/433 ,  H01L23/538 ,  H01L25/04 ,  H01L25/18

Abstract: A microelectronic package fabrication technology that attaches at least one microelectronic die onto a heat spreader and encapsulates the microelectronic die/dice thereon which may further include a microelectronic packaging core abutting the heat spreader wherein the microelectronic die/dice reside within at least one opening in a microelectronic package core. After encapsulation, build-up layers may be fabricated to form electrical connections with the microelectronic die/dice.