Abstract:
PROBLEM TO BE SOLVED: To provide a system which allows PC compatibility, in regard to PC compatibility wherein reuse of a component is limited in accordance with change in silicon process by mixing of a physical level regulated in an interface and a transaction level in a conventional system on chip (SoC) system. SOLUTION: The system includes an apparatus having an adapter to communicate according to a personal computer (PC) protocol and a second protocol. A first interface coupled to the adapter is to perform address translation and ordering of transactions received from upstream of the adapter. The first interface is similarly coupled via one or more physical units to heterogeneous resources. COPYRIGHT: (C)2011,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a method for achieving PC compatibility in a system on chip (SoC) system. SOLUTION: In order to achieve use of a resource of a different sort such as a PCI-based system AXI/OCP technique, modular interconnection of a transaction level of a PC compatible SoC component is performed. Since the transaction level can be separated from a prescribed physical level in the specifications of the SoC component, a function for mapping a PCI (or another bus-based) system in a point-to-point (PtP) interconnection system, a function for PtP interconnecting target-based decoding, and target-based decoding in the PC compatible system and other PC compatible function are achieved through logic. COPYRIGHT: (C)2010,JPO&INPIT
Abstract:
Methods and apparatus relating to improving address translation caching and/or input/output (I/O) cache performance in virtualized environments are described. In one embodiment, a hint provided by an endpoint device may be utilized to update information stored in an I/O cache. Such information may be utilized for implementation of a more efficient replacement policy in an embodiment. Other embodiments are also disclosed.
Abstract:
In one embodiment, a converged protocol stack can be used to unify communications from a first communication protocol to a second communication protocol to provide for data transfer across a physical interconnect. This stack can be incorporated in an apparatus that includes a protocol stack for a first communication protocol including transaction and link layers, and a physical (PHY) unit coupled to the protocol stack to provide communication between the apparatus and a device coupled to the apparatus via a physical link. This PHY unit may include a physical unit circuit according to the second communication protocol. Other embodiments are described and claimed.
Abstract:
In one embodiment, the present invention includes a fabric on a first semiconductor die to communicate with at least one agent on the die according to an on-chip protocol and a packetization layer coupled to the fabric to receive command and data information from the fabric on multiple links and to packetize the information into a packet for transmission from the die to another die via an in-package packetized link. Other embodiments are described and claimed
Abstract:
Methods and apparatus for control of On-Die System Fabric (OSF) blocks are described. In one embodiment, a shadow address corresponding to a physical address may be stored in response to a user-level request and a logic circuitry (e.g., present in an OSF) may determine the physical address from the shadow address. Other embodiments are also disclosed.
Abstract:
In one embodiment, a converged protocol stack can be used to unify communications from a first communication protocol to a second communication protocol to provide for data transfer across a physical interconnect. This stack can be incorporated in an apparatus that includes a protocol stack for a first communication protocol including transaction and link layers, and a physical (PHY) unit coupled to the protocol stack to provide communication between the apparatus and a device coupled to the apparatus via a physical link. This PHY unit may include a physical unit circuit according to the second communication protocol. Other embodiments are described and claimed.
Abstract:
In one embodiment, the present invention includes a method for transmitting a packet from a transmitter to a receiver along an interconnect and terminating transmission of the packet at a packet disconnect boundary, which has a length less than a payload length of the packet. After such termination, another packet such as a higher priority packet can be transmitted, or a remainder of the original packet may be transmitted as a separate packet. Other embodiments are described and claimed.