Abstract:
In one embodiment, an apparatus includes a clock control circuit to generate a clock signal for communication on an interconnect. The clock control circuit may be configured to receive an indication of a next device of a plurality of devices to be accessed and to dynamically update a control signal to cause the communication of the clock signal to be dynamically switched between a fixed clock frequency and a spread spectrum clock frequency based at least in part on the indication of communication to the next device. Other embodiments are described and claimed.
Abstract:
In one embodiment, a host controller is to couple to an interconnect to which a plurality of devices may be coupled. The host controller may include: a first driver to drive first information onto the interconnect; and a first receiver to receive second information comprising parameter information of at least one of the plurality of devices from the interconnect. The host controller may further include an integrity control circuit to receive the parameter information of the at least one of the plurality of devices and dynamically update at least one capability of the host controller based at least in part on the parameter information. Other embodiments are described and claimed.
Abstract:
In an embodiment, a host device includes: a transceiver to communicate information on an interconnect; a controller to control operation of the transceiver and to be a master for the interconnect; and a role transfer logic to cause a secondary device to be the master for the interconnect when at least a portion of the host device is to enter into a low power. Other embodiments are described and claimed.
Abstract:
Various devices, systems, and/or methods perform wireless chip to chip high speed data transmission. Strategies for such transmission include use of improved microbump antennas, wireless chip to chip interconnects, precoding and decoding strategies, channel design to achieve spatial multiplexing gain in line of sight transmissions, open cavity chip design for improved transmission, and/or mixed signal channel equalization.
Abstract:
In one example a magnetometer unit comprises logic to receive first magnetic response data from a first magnetic sensor and second magnetic response data from a second magnetic sensor displaced from the first magnetic sensor, generate a composite response surface representation from the first magnetic response data and the second magnetic response data, and store the composite response surface representation in a non-transitory memory. Other examples may be described.
Abstract:
In one example a sensor module comprises at least one sensor and a controller communicatively coupled to the at least one sensor by a communication bus, the controller comprising logic, at least partially including hardware logic, configured to generate a signal to configure the at least one sensor in a notify power state mode and place the signal on a communication bus coupled to the at least one sensor. Other examples may be described.
Abstract:
A magnetometer unit which may be incorporated in an electronic device receives first magnetic response data from a first magnetic sensor and second magnetic response data from a second magnetic sensor displaced from the first magnetic sensor. The magnetometer unit generates a composite response surface representation from the first magnetic response data and the second magnetic response data, and stores the composite response surface representation in a non-transitory memory.
Abstract:
A package substrate may include a circuit and a leaky surface wave launcher. The circuit may perform engineering tests and end-user operations using sideband signals. The leaky surface wave launcher may perform near field wireless communication. The leaky surface wave launcher may include a via and a strip line. The via may be electrically coupled to the circuit. The via may provide the sideband signals to and receive the sideband signals from the circuit. The strip line may be electrically coupled to the via. The strip line may be excited by the sideband signals to wirelessly couple the leaky surface wave launcher with an external device. The strip line and the via may be unbalanced such that the strip line generates a leaky wave that propagates at least a portion of the package substrate and an environment proximate the package substrate.
Abstract:
A package substrate may include a circuit and a leaky surface wave launcher. The circuit may perform engineering tests and end-user operations using sideband signals. The leaky surface wave launcher may perform near field wireless communication. The leaky surface wave launcher may include a via and a strip line. The via may be electrically coupled to the circuit. The via may provide the sideband signals to and receive the sideband signals from the circuit. The strip line may be electrically coupled to the via. The strip line may be excited by the sideband signals to wirelessly couple the leaky surface wave launcher with an external device. The strip line and the via may be unbalanced such that the strip line generates a leaky wave that propagates at least a portion of the package substrate and an environment proximate the package substrate.