公开(公告)号：WO2023038786A1

公开(公告)日：2023-03-16

申请号：PCT/US2022/041126

申请日：2022-08-22

Applicant: INTEL CORPORATION

Inventor： PIETAMBARAM, Srinivas V. ,  MARIN, Brandon C. ,  MALLIK, Debendra ,  IBRAHIM, Tarik A. ,  ECTON, Jeremy ,  KARHADE, Omkar G. ,  PENMECHA, Bharat Prasad ,  LI, Xiaoqian ,  DESHPANDE, Nitin A. ,  MODI, Mitul ,  NIE, Bai

IPC: H01L25/16 ,  G02B6/12 ,  H01L23/13 ,  H01L23/15 ,  H01L23/538 ,  H01L21/52

Abstract: An optoelectronic assembly is disclosed, comprising a substrate having a core comprised of glass, and a photonic integrated circuit (PIC) and an electronic IC (EIC) coupled to a first side of the substrate. The core comprises a waveguide with a first endpoint proximate to the first side and a second endpoint exposed on a second side of the substrate orthogonal to the first side. The first endpoint of the waveguide is on a third side of the core parallel to the first side of the substrate. The substrate further comprises an optical via aligned with the first endpoint, and the optical via extends between the first side and the third side. In various embodiments, the waveguide is of any shape that can be inscribed by a laser between the first endpoint and the second endpoint.