公开(公告)号：WO2018182656A1

公开(公告)日：2018-10-04

申请号：PCT/US2017/025208

申请日：2017-03-30

Applicant: INTEL CORPORATION ,  RADHAKRISHNAN, Kaladhar

Inventor： RADHAKRISHNAN, Kaladhar ,  LEE, Jaejin ,  HSU, Hao-Han ,  CHEN, Chung-Hao, J. ,  HAN, Dong-Ho

IPC: H01L23/552 ,  H01L23/522 ,  H01L23/64 ,  H01L23/66

CPC classification number: H01L23/5227 ,  H01L23/5225 ,  H01L23/552 ,  H01L23/645 ,  H01L23/66 ,  H01L2223/6666 ,  H01L2223/6677

Abstract: Semiconductor packages and a method of forming a semiconductor package are described. The semiconductor package has a foundation layer, a conductive layer formed in the foundation layer, and a magnetic layer formed between the conductive and the foundation layer. The conductive layer and the magnetic layer are coupled to form a low-profile inductor shield. The semiconductor package also has a dielectric layer formed between the magnetic and foundation layer. The foundation layer is mounted between a motherboard and a semiconductor die, where the foundation layer is attached to the motherboard with solder balls. Accordingly, the low-profile inductor shield may include a z-height that is less than a z-height of the solder balls. The low-profile inductor shield may have solder pads that are coupled to the conductive layer. The foundation layer may include at least one of voltage regulator and inductor, where the inductor is located above the low-profile inductor shield.

公开(公告)号：WO2021133404A1

公开(公告)日：2021-07-01

申请号：PCT/US2019/068649

申请日：2019-12-27

Applicant: INTEL CORPORATION

Inventor： HAN, Dong-Ho ,  KULKARNI, Shantanu ,  LARSEN, Denica ,  LEE, Jaejin ,  LEE, Kwan Ho

IPC: H01Q1/52 ,  H01Q1/24

Abstract: An electronic computing device with a self-shielding antenna. An electronic computing device may include a frame, an antenna, and an antenna shielding. The frame includes a top cover and a bottom cover. Electronic components are included in a space formed between the top cover and the bottom cover. The antenna is for wireless transmission and reception and included in the frame near an edge of the frame. The antenna shielding is disposed around the antenna for providing electro-magnetic shielding from radio frequency (RE) noises generated from the electronic components included in the frame. The antenna shielding may be a metal wall disposed between the top cover and the bottom cover around the antenna. The frame may be a metallic frame and may include a cut-out in the top cover and the bottom cover above and below the antenna, and a non-metallic cover may be provided in the cut-out.

公开(公告)号：WO2020068268A1

公开(公告)日：2020-04-02

申请号：PCT/US2019/044438

申请日：2019-07-31

Applicant: INTEL CORPORATION

Inventor： LEE, Jaejin ,  CHEN, Chung-Hao ,  HSU, Hao-Han ,  LI, Xiang ,  LIAO, Jun

IPC: H05K9/00 ,  G06F1/18 ,  H05K1/02

Abstract: An electromagnetic interference (EMI) shielding can be couplable to a circuit board. The EMI shielding can include a fence couplable to the circuit board, a lid couplable to the fence, and a shield arm extending from the lid and being configured to couple to the fence. The shield arm can be hingedly or rotatably coupled to the lid. The shield arm can be magnetically couplable to the lid. The shield arm and/or the fence can include a magnet to provide a magnetic attraction between the shield arm and the fence.

公开(公告)号：WO2018186954A1

公开(公告)日：2018-10-11

申请号：PCT/US2018/020467

申请日：2018-03-01

Applicant: INTEL CORPORATION

Inventor： LEE, Jaejin ,  HSU, Hao-Han ,  CHEN, Chung-Hao J.

IPC: H02J50/12 ,  H02J7/02 ,  H02J5/00

Abstract: Techniques for focusing the energy radiated by a wireless power transmitting unit are described. An example power transmitting unit includes a transmit coil configured to generate a magnetic field to wirelessly power a device within an active wireless charging area. The power transmitting unit also includes a power generating circuitry to deliver current to the transmit coil to generate the magnetic field. The power transmitting unit also includes a ferrite structure disposed below the transmit coil, the ferrite structure comprising a flat sheet and a projection of ferrite material projecting above the flat sheet.

公开(公告)号：WO2022098342A1

公开(公告)日：2022-05-12

申请号：PCT/US2020/058622

申请日：2020-11-03

Applicant: INTEL CORPORATION

Inventor： THAKUR, Jayprakash ,  DEGANI, Ofir ,  KRONFELD, Ronen ,  RESHEF, Ehud ,  SUH, Seong-Youp, J. ,  SHOSHANA, Tal ,  MANN, Eytan ,  TAMRAKAR, Maruti ,  RAVI, Ashoke ,  CAMACHO PEREZ, Jose Rodrigo ,  HUUSARI, Timo Sakari ,  BOROKHOVICH, Eli ,  RUBIN, Amir ,  BENJAMIN, Ofer ,  YANG, Tae Young ,  SKINNER, Harry ,  LEE, Kwan Ho ,  LEE, Jaejin ,  HAN, Dong-Ho ,  GROSS, Shahar ,  SEGEV, Eran ,  KAMGAING, Telesphor

IPC: H04B1/50 ,  H04B1/00 ,  H04B1/44 ,  H01Q1/24

Abstract: In various aspects, a radio frequency circuit is provided. The radio frequency circuit may include a substrate that may include a radio frequency front-end to antenna (RF FE-to-Ant) connector. The RF FE-to-Ant connector may include a conductor track structure and a substrate connection structure coupled to the conductor track structure. The substrate may include radio frequency front-end circuitry monolithically integrated in the substrate. The substrate connection structure may include at least one of a solderable structure, a weldable structure, or an adherable structure. The substrate connection structure may be configured to form at least one radio frequency signal interface with an antenna circuit connection structure of a substrate-external antenna circuit. The substrate may include an edge region. The substrate connection structure may be disposed in the edge region.

公开(公告)号：WO2018125424A1

公开(公告)日：2018-07-05

申请号：PCT/US2017/062197

申请日：2017-11-17

Applicant: INTEL CORPORATION

Inventor： LEE, Jaejin ,  HSU, Hao-Han

IPC: H01R13/6581

CPC classification number: H01R13/6581 ,  H01R12/724 ,  H01R13/6594 ,  H01R13/6598 ,  H01R43/26 ,  H01R2201/06 ,  H05K9/0022

Abstract: Particular embodiments described herein provide for a connector shield that can include a main body, a shield portion to shield electromagnetic radiation from a connector, and a support portion. The main body can be removably secured to the connector. In an example, the shield portion includes lossy material and the shield portion is not grounded. The connector can include connection lines and the connection lines are at least partially inside a cavity of the shield portion.

公开(公告)号：WO2018080676A1

公开(公告)日：2018-05-03

申请号：PCT/US2017/052792

申请日：2017-09-21

Applicant: INTEL CORPORATION

Inventor： HSU, Hao-Han ,  HO, Ying Ern ,  LEE, Jaejin

IPC: H01L23/12 ,  H01L23/48 ,  H01L23/485 ,  H01L23/00

CPC classification number: H01L23/562 ,  H01L23/498 ,  H01L23/552 ,  H01L23/66 ,  H01L2223/6644 ,  H01L2223/6677 ,  H01L2224/32225 ,  H01L2924/15311 ,  H01L2924/3511

Abstract: Embodiments herein may relate to a package with one or more layers. A silicon die may be coupled with the one or more layers via an adhesive. A package stiffener may also be coupled with the adhesive adjacent to the die. A magnetic thin film may be coupled with the package stiffener. Other embodiments may be described and/or claimed.

Abstract translation: 这里的实施例可以涉及具有一个或多个层的封装。 硅裸片可以通过粘合剂与一个或多个层耦合。 包装加强件也可以与邻近于模具的粘合剂连接。 磁性薄膜可以与封装加强件耦合。 其他实施例可以被描述和/或要求保护。

公开(公告)号：EP3882967A2

公开(公告)日：2021-09-22

申请号：EP20215675.8

申请日：2020-12-18

Applicant: Intel Corporation

Inventor： LEE, Jaejin ,  COX, Christopher E. ,  LIAO, Jun ,  LI, Xiang

IPC: H01L23/552 ,  H01L23/31

Abstract: A memory device includes a grounded molding. The memory device includes a substrate having a first surface for a memory die, where the substrate has ground vias through substrate to connect to a ground reference. The substrate has a ball grid array (BGA) on the opposite surface, including perimeter balls to connect to ground connections. The grounded molding includes an electrically conductive epoxy mold to cover the memory die, where the electrical conductivity of the molding, with the molding grounded can provide radio frequency interference (RFI) shielding.

公开(公告)号：EP3462487A1

公开(公告)日：2019-04-03

申请号：EP18191353.4

申请日：2018-08-28

Applicant: INTEL Corporation

Inventor： LEE, Jaejin ,  HSU, Hao-Han ,  CHEN, Chung-Hao J. ,  HAN, Dong-Ho

IPC: H01L23/552 ,  H01L23/16 ,  H01L23/66

Abstract: Electronic device packages utilizing a stiffener coupled to a substrate with a magnetic lossy bonding layer to attenuate or absorb electromagnetic signals such as radio frequency interference (RFI) along with related systems and method are disclosed.

公开(公告)号：EP4021158A1

公开(公告)日：2022-06-29

申请号：EP21198064.4

申请日：2021-09-21

Applicant: INTEL Corporation

Inventor： LEE, Jaejin ,  SIMPSON, Isaac ,  HAN, Dong-Ho ,  SALAZAR DELGADO, Jose ,  NAVARRO ALVAREZ, Arturo

IPC: H05K9/00 ,  H05K7/20

Abstract: Electromagnetic interference (EMI) shields having attenuation interfaces are disclosed. A disclosed example EMI shield includes side walls defining sides of the EMI shield, and an attenuation interface to be placed into contact with a circuit board. The attenuation interface includes an inner perimeter having an EMI absorber and an outer perimeter having a metal backing to at least partially surround the EMI absorber.