DEVICE, METHOD AND SYSTEM FOR FORMING A SOLDERED CONNECTION BETWEEN CIRCUIT COMPONENTS
    1.
    发明申请
    DEVICE, METHOD AND SYSTEM FOR FORMING A SOLDERED CONNECTION BETWEEN CIRCUIT COMPONENTS 审中-公开
    用于形成电路元件之间的焊接连接的装置,方法和系统

    公开(公告)号:WO2018004821A1

    公开(公告)日:2018-01-04

    申请号:PCT/US2017/030886

    申请日:2017-05-03

    Abstract: Techniques and mechanisms for controlling configurable circuitry including an antifuse. In an embodiment, the antifuse is disposed in or on a substrate, the antifuse configured to form a solder joint to facilitate interconnection of circuit components. Control circuitry to operate with the antifuse is disposed in, or at a side of, the same substrate. The antifuse is activated based on a voltage provided at an input node, where the control circuitry automatically transitions through a pre-determined sequence of states in response to the voltage. The pre-determined sequence of states coordinates activation of one or more fuses and switched coupling one or more circuit components to the antifuse. In another embodiment, multiple antifuses, variously disposed in or on the substrate, are configured each to be activated based on the voltage provided at an input node.

    Abstract translation: 用于控制包括反熔丝的可配置电路的技术和机制。 在一个实施例中,反熔丝被设置在衬底中或衬底上,反熔丝被配置成形成焊点以促进电路元件的互连。 与反熔丝一起操作的控制电路设置在同一衬底中或同一衬底的一侧。 基于在输入节点处提供的电压激活反熔丝,其中控制电路响应于电压而自动转换通过预定状态序列。 预定的状态序列协调一个或多个熔断器的激活并将一个或多个电路部件切换耦合到反熔丝。 在另一个实施例中,不同地设置在衬底中或衬底上的多个反熔丝被配置为每一个都基于在输入节点处提供的电压而被激活。

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