公开(公告)号：WO2023043529A1

公开(公告)日：2023-03-23

申请号：PCT/US2022/037181

申请日：2022-07-14

Applicant: INTEL CORPORATION

Inventor： COLLINS, Andrew ,  PIETAMBARAM, Srinivas V. ,  XIE, Jianyong ,  VALAVALA, Krishna Vasanth

IPC: H01L23/498 ,  H01L23/14 ,  H01L21/48 ,  H01L23/538

Abstract: Embodiments described herein may be related to apparatuses, processes, and techniques directed to bridges having a glass core, where the bridges may include one or more thick traces and one or more thin traces, where the thin traces are layered closer to a surface of the glass core, and the thick traces are layered further away from the glass core. During operation, the thin traces may be used to transmit signals between the coupled dies, and the thick traces may be used to transmit power between the coupled dies. During manufacture, the rigidity and highly planner surface of the glass core may enable thinner traces closer to the surface of the glass core to be placed with greater precision resulting in increased overall quality and robustness of transmitted signals. Other embodiments may be described and/or claimed.