公开(公告)号：US10347558B2

公开(公告)日：2019-07-09

申请号：US15748475

申请日：2015-08-31

Applicant: INTEL IP CORPORATION

Inventor： Christian Geissler ,  Georg Seidemann ,  Sonja Koller ,  Jan Proschwitz

IPC: H01L23/00 ,  H01L25/065 ,  H01L23/367 ,  H01L25/04 ,  H01L25/07 ,  H01L23/13 ,  H01L23/36 ,  H01L23/42 ,  H01L21/56 ,  H01L23/498

Abstract: Embodiments herein generally relate to the field of package assembly to facilitate thermal conductivity. A package may have a hanging die, and attach to a printed circuit board (PCB). The package may have an active side plane and an inactive side plane opposite the first active side plane. The package may also have a ball grid array (BGA) matrix having a height determined by a distance of a furthest point of the BGA matrix from the active side plane of the package. The package may have a hanging die attached to the active side plane of the package, the hanging die having a z-height greater than the BGA matrix height. When package is attached to the PCB, the hanging die may fit into an area on the PCB that is recessed or has been cut away, and a thermal conductive material may connect the hanging die and the PCB.