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    Electronic device and method of manufacturing electronic device
    1.
    发明授权
    Electronic device and method of manufacturing electronic device 有权

    公开(公告)号：US12211811B2

    公开(公告)日：2025-01-28

    申请号：US17702812

    申请日：2022-03-24

    Applicant: Industrial Technology Research Institute

    Inventor： Yu-Ming Peng ,  Chien-Chou Tseng ,  Chih-Chia Chang ,  Kuan-Chu Wu ,  Yu-Lin Hsu

    IPC: H01L23/00 ,  H01L21/66 ,  H01L23/13 ,  H01L23/14 ,  H01L33/62

    Abstract: An electronic device includes a substrate, an electronic component, a first interposing layer and a second interposing layer. The substrate is non-planar and the substrate includes a first substrate pad and a second substrate pad. The electronic component includes a first component pad and a second component pad corresponding to the first substrate pad and the second substrate pad respectively. When the first component pad contacts the first substrate pad, a height difference exists between the second component pad and the second substrate pad. The first interposing layer connects between the first component pad and the first substrate pad. The second interposing layer connects between the second component pad and the second substrate pad. A thickness difference between the first interposing layer and the second interposing layer is 0.5 to 1 time the height difference.

    Strain measurement method and strain measurement apparatus
    3.
    发明授权
    Strain measurement method and strain measurement apparatus 有权

    公开(公告)号：US11204240B2

    公开(公告)日：2021-12-21

    申请号：US16937592

    申请日：2020-07-24

    Applicant: Industrial Technology Research Institute

    Inventor： I-Hung Chiang ,  Hung-Hsien Ko ,  Cheng-Ta Pan ,  Yu-Lin Hsu ,  Kuo-Hua Tseng

    IPC: G01B11/16 ,  G01N21/88 ,  G06T7/55

    Abstract: A strain measurement method includes disposing a 3D camera module at a first measurement position; using the 3D camera module to acquire a first 3D image of a to-be-measured object at a first to-be-measured position; acquiring a second 3D image of the to-be-measured object at the first to-be-measured position; and splicing the first and second 3D images to obtain an initial 3D image. The method still includes: moving the 3D camera module from the first measurement position to a second measurement position; using the 3D camera module to acquire a third 3D image of the to-be-measured object at a second to-be-measured position; acquiring a fourth 3D image of the to-be-measured object at the second to-be-measured position; and splicing the third and fourth 3D images to obtain a deformed 3D image. The method further includes comparing the initial 3D image and the deformed 3D image to output 3D deformation information.

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