公开(公告)号：WO2017213652A1

公开(公告)日：2017-12-14

申请号：PCT/US2016/036593

申请日：2016-06-09

Applicant: INNOVATIVE MICRO TECHNOLOGY

Inventor： GUDEMAN, Christopher ,  RUBEL, Paul

IPC: H01L21/447 ,  H01L21/02 ,  H01L21/50 ,  H01L21/603

Abstract: A method for bonding two substrates is described, comprising providing a first and a second silicon substrate, providing a raised feature on at least one of the first and the second silicon substrate, forming a layer of gold on the first and the second silicon substrates, and pressing the first substrate against the second substrate, to form a thermocompression bond around the raised feature. The high initial pressure caused by the raised feature on the opposing surface provides for a hermetic bond without fracture of the raised feature, while the complete embedding of the raised feature into the opposing surface allows for the two bonding planes to come into contact. This large contact area provides for high strength.

Abstract translation: 描述了用于键合两个衬底的方法，包括提供第一硅衬底和第二硅衬底，在第一硅衬底和第二硅衬底中的至少一个上提供凸起特征，在其上形成金层 第一和第二硅衬底，并且将第一衬底压靠在第二衬底上，以围绕凸起特征形成热压缩结合。 由相对表面上的凸起特征引起的高初始压力提供密封结合而不使凸起特征断裂，而将凸起特征完全嵌入相对表面允许两个接合平面接触。 这个大的接触面积提供了很高的强度。

公开(公告)号：WO2015038367A2

公开(公告)日：2015-03-19

申请号：PCT/US2014/053677

申请日：2014-09-02

Applicant: INNOVATIVE MICRO TECHNOLOGY

Inventor： GUDEMAN, Christopher ,  SEN, Prosenjit

CPC classification number: H01L21/486 ,  B81B7/007 ,  B81B2207/095 ,  B81B2207/096 ,  B81C1/00095 ,  H01L21/76898 ,  H01L23/481 ,  H01L31/02167 ,  H01L31/03529 ,  H01L31/052 ,  H01L31/068 ,  H01L2924/0002 ,  Y02E10/547 ,  H01L2924/00

Abstract: A method for forming through substrate vias (TSVs) in a non-conducting, glass substrate is disclosed. The method involves patterning a silicon template substrate with a plurality of lands and spaces, bonding a slab or wafer of glass to the template substrate, and melting the glass so that it flows into the spaces formed in the template substrate. The template substrate may then be removed to leave a plurality of TSVs in the glass slab or wafer.

Abstract translation: 公开了一种用于在非导电玻璃基板中形成贯穿衬底通孔（TSV）的方法。 该方法包括用多个焊盘和间隔图案化硅模板衬底，将玻璃板或玻璃晶片粘合到模板衬底上，并且熔化玻璃使其流入形成在模板衬底中的空间。 然后可以移除模板衬底以在玻璃板或晶片中留下多个TSV。

公开(公告)号：WO2011149503A1

公开(公告)日：2011-12-01

申请号：PCT/US2011/000678

申请日：2011-04-14

Applicant: INNOVATIVE MICRO TECHNOLOGY ,  FOSTER, John, Stuart ,  GUDEMAN, Christopher

Inventor： FOSTER, John, Stuart ,  GUDEMAN, Christopher

IPC: B81B7/02

CPC classification number: F04B43/043

Abstract: A micromechanical pumping system is formed on a substrate surface. The pumping system uses a pumping element which pumps a fluid through valves which move in a plane substantially parallel to the substrate surface. An electromagnetic actuating mechanism may also be fabricated on the surface of the substrate. Magnetic flux produced by a coil around a permeable core may be coupled to a permeable member affixed to a pumping element. The permeable member and pumping element may be configured to move in a plane parallel to the substrate. The electromagnetic actuating mechanism gives the pumping system a large throw and substantial force, such that the fluid pumped by the pumping system may be pumped through a transdermal cannula to deliver a therapeutic substance to the tissue underlying the skin of a patient.

Abstract translation: 在基板表面上形成微机械泵送系统。 泵送系统使用泵送元件，该元件通过在基本上平行于衬底表面的平面中移动的阀来泵送流体。 也可以在基板的表面上制造电磁致动机构。 线圈围绕可渗透芯体产生的磁通可以耦合到固定到泵送元件的可渗透构件。 可渗透构件和泵送元件可以构造成在平行于衬底的平面中移动。 电磁致动机构使泵送系统产生大的冲击力和相当大的力，使得由泵送系统泵送的流体可以泵送通过透皮套管，以将治疗物质递送到患者皮肤下方的组织。

公开(公告)号：EP3469625A1

公开(公告)日：2019-04-17

申请号：EP16904801.4

申请日：2016-06-09

Applicant: Innovative Micro Technology

Inventor： GUDEMAN, Christopher ,  RUBEL, Paul

IPC: H01L21/447 ,  H01L21/02 ,  H01L21/50 ,  H01L21/603