公开(公告)号：WO2017213652A1

公开(公告)日：2017-12-14

申请号：PCT/US2016/036593

申请日：2016-06-09

Applicant: INNOVATIVE MICRO TECHNOLOGY

Inventor： GUDEMAN, Christopher ,  RUBEL, Paul

IPC: H01L21/447 ,  H01L21/02 ,  H01L21/50 ,  H01L21/603

Abstract: A method for bonding two substrates is described, comprising providing a first and a second silicon substrate, providing a raised feature on at least one of the first and the second silicon substrate, forming a layer of gold on the first and the second silicon substrates, and pressing the first substrate against the second substrate, to form a thermocompression bond around the raised feature. The high initial pressure caused by the raised feature on the opposing surface provides for a hermetic bond without fracture of the raised feature, while the complete embedding of the raised feature into the opposing surface allows for the two bonding planes to come into contact. This large contact area provides for high strength.

Abstract translation: 描述了用于键合两个衬底的方法，包括提供第一硅衬底和第二硅衬底，在第一硅衬底和第二硅衬底中的至少一个上提供凸起特征，在其上形成金层 第一和第二硅衬底，并且将第一衬底压靠在第二衬底上，以围绕凸起特征形成热压缩结合。 由相对表面上的凸起特征引起的高初始压力提供密封结合而不使凸起特征断裂，而将凸起特征完全嵌入相对表面允许两个接合平面接触。 这个大的接触面积提供了很高的强度。

公开(公告)号：EP3469625A1

公开(公告)日：2019-04-17

申请号：EP16904801.4

申请日：2016-06-09

Applicant: Innovative Micro Technology

Inventor： GUDEMAN, Christopher ,  RUBEL, Paul

IPC: H01L21/447 ,  H01L21/02 ,  H01L21/50 ,  H01L21/603