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1.发明申请公开(公告)号：US20160130713A1
公开(公告)日：2016-05-12
申请号：US14997636
申请日：2016-01-18
Applicant: Integran Technologies Inc.
Inventor： Klaus Tomantschger , Diana Facchini , Francisco Gonzalez , Jonathan McCrea , John Kratochwil , Dan Woloshyn , Yusuf Bismilla , Nandakumar Nagarajan , Mioara Neacsu
Abstract: A method for electrodepositing a coating/free-standing layer on a workpiece in an electrolytic cell includes moving the workpiece and an anode applicator tool having a consumable anode insert relative to each other; anodically dissolving a metal from the insert and cathodically depositing the metal on the workpiece; providing flow of electrolyte solution through the insert to ensure that greater than 90% of the anodic reaction is represented by dissolution of the metal; recirculating collected electrolyte solution exiting the electrolytic cell through the insert; applying an electric current to the electrolytic cell; maintaining a concentration of the anodically dissolved metal within ±25% of each Ampere-hour per liter of electroplating solution; and creating a cathodic electrodeposit on the workpiece which includes the anodically dissolved metal, the chemical composition of the deposit varying by less than 25% in the deposition direction over a selected thickness of up to 25 microns of the deposit.
Abstract translation: 一种用于在电解池中将工件上的涂层/独立层电沉积的方法包括相对于彼此移动工件和具有可消耗阳极插入件的阳极施用工具; 将金属从插入物阳极溶解并将金属阴极沉积在工件上; 提供电解质溶液通过插入物的流动，以确保大于90％的阳极反应由金属的溶解表示; 通过插入物再循环离开电解池的收集的电解质溶液; 向电解槽施加电流; 将阳极溶解的金属的浓度保持在每升电镀溶液的每安培小时的±25％内; 并且在包括阳极溶解的金属的工件上产生阴极电沉积物，沉积物的沉积方向上的沉积物的化学成分在沉积方向上选择厚度高达25微米的选定厚度变化小于25％。
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公开(公告)号：US09970120B2
公开(公告)日：2018-05-15
申请号：US14997636
申请日：2016-01-18
Applicant: Integran Technologies Inc.
Inventor： Klaus Tomantschger , Diana Facchini , Francisco Gonzalez , Jonathan McCrea , John Kratochwil , Dan Woloshyn , Yusuf Bismilla , Nandakumar Nagarajan , Mioara Neacsu
Abstract: A method for electrodepositing a coating/free-standing layer on a workpiece in an electrolytic cell includes moving the workpiece and an anode applicator tool having a consumable anode insert relative to each other; anodically dissolving a metal from the insert and cathodically depositing the metal on the workpiece; providing flow of electrolyte solution through the insert to ensure that greater than 90% of the anodic reaction is represented by dissolution of the metal; recirculating collected electrolyte solution exiting the electrolytic cell through the insert; applying an electric current to the electrolytic cell; maintaining a concentration of the anodically dissolved metal within ±25% of each Ampere-hour per liter of electroplating solution; and creating a cathodic electrodeposit on the workpiece which includes the anodically dissolved metal, the chemical composition of the deposit varying by less than 25% in the deposition direction over a selected thickness of up to 25 microns of the deposit.
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