公开(公告)号：US11201420B2

公开(公告)日：2021-12-14

申请号：US16976380

申请日：2018-06-22

Applicant: Intel Corporation

Inventor： Jun Lu ,  Wei Liao ,  Guangying Zhang ,  Liguang Du ,  Guoliang Ying ,  Fangbo Zhu ,  Song Kok Hang ,  Juan A. Orozco Ramirez ,  Wesley B. Morgan

IPC: H01R12/70 ,  G06F1/18 ,  H01R13/627

Abstract: Herein described are apparatuses and systems for facilitating alignment of computer component connectors. A package protector may include a body to at least partially surround an integrated circuit package of a circuit card when the package protector is mounted to the circuit card. The package protector may further include a guide pin component that extends from a side of the body, wherein the guide pin component is to be located adjacent to a header of the circuit card when the package protector is mounted to the circuit card, wherein a connector uses the guide pin component to align with the header via a guide pin.

公开(公告)号：US20190319385A1

公开(公告)日：2019-10-17

申请号：US16465087

申请日：2016-12-29

Applicant: Intel Corporation

Inventor： Guoliang Ying ,  Na Chen ,  Liguang Du

IPC: H01R12/73 ,  H05K1/09 ,  H05K1/11 ,  H05K1/02 ,  H05K1/18 ,  H01R31/06

Abstract: Aspects of the embodiments are directed to a printed circuit board (PCB) that includes a conductive layer extending from the printed circuit board to act as a heat sink for circuit components electrically and mechanically attached to the PCB. The conductive layer can be a copper ground layer of a multi-layered PCB. The PCB can include one or more circuit components, such as dynamic random access memory elements. In embodiments, the PCB is part of a dual inline memory module. The conductive layer can be fashioned such that it extends out from the PCB and returns over the circuit elements to define an air gap between the conductive layer and the surface of the PCB and/or the surface of the circuit elements. In embodiments, a connection adaptor can be used to accommodate various PCB thicknesses so that the PCB can be electrically connected to an edge connector.

公开(公告)号：US20250081396A1

公开(公告)日：2025-03-06

申请号：US18948081

申请日：2024-11-14

Applicant: Intel Corporation

Inventor： Guangying Zhang ,  Chuanlou Wang ,  Yuehong Fan ,  Shaorong Zhou ,  Yang Yao ,  Yingqiong Bu ,  Xiang Que ,  Guoliang Ying

IPC: H05K7/20

Abstract: Immersion cooling systems are disclosed. An example immersion cooling system includes an immersion tank including a cooling fluid and a reservoir to contain a recirculated portion of the cooling fluid. The reservoir is separated from the immersion tank by a height to generate a liquid surface height variance between the cooling fluid in the immersion tank and the cooling fluid in the reservoir. A supply conduit is to fluidly couple the immersion tank and the reservoir. The cooling fluid to be provided from the reservoir to the immersion tank via gravity.

公开(公告)号：US20240260228A1

公开(公告)日：2024-08-01

申请号：US18565916

申请日：2022-04-01

Applicant: Intel Corporation

Inventor： Jimmy Chuang ,  Jin Yang ,  Yuan-Liang Li ,  David Shia ,  Yuehong Fan ,  Hao Zhou ,  Sandeep Ahuja ,  Peng Wei ,  Ming Zhang ,  Je-Young Chang ,  Paul J. Gwin ,  Ra'anan Sover ,  Lianchang Du ,  Eric D. McAfee ,  Timothy Glen Hanna ,  Liguang Du ,  Qing Jiang ,  Xicai Jing ,  Liu Yu ,  Guoliang Ying ,  Cong Zhou ,  Yinglei Ren ,  Xinfeng Wang

IPC: H05K7/20

CPC classification number: H05K7/20236 ,  H05K7/20254 ,  H05K7/20263 ,  H05K7/20463

Abstract: Immersion cooling systems, apparatus, and related methods for cooling electronic computing platforms and/or associated electronic components are disclosed herein. An example apparatus includes a first chamber including a first coolant disposed therein, the first coolant having a first boiling point. The example apparatus further includes a second chamber disposed in the first chamber, the second chamber to receive an electronic component therein. The second chamber includes a second coolant having a second boiling point different that the first boiling point. The second chamber is to separate the electronic component and the second coolant from the first coolant.

公开(公告)号：US11437297B2

公开(公告)日：2022-09-06

申请号：US17255415

申请日：2018-09-28

Applicant: Intel Corporation

Inventor： Guoliang Ying ,  Jun Lu ,  Guangying Zhang ,  Xinglong Xu ,  Wei Liao ,  Fangbo Zhu

IPC: H01L23/40 ,  H01L23/02 ,  H01L23/00 ,  H01L21/50 ,  H01L23/367

Abstract: Systems, apparatuses, processes, and techniques are provided which are related to a vapor chamber (750) having a first side and a second side opposite the first side, where the first side is to thermally couple to a heat sink (708) and the second side to thermally couple to a heat source. The vapor chamber (750) may include a compressible mechanism disposed within the vapor chamber (750) coupled with the first side and the second side where the second side, when coupled to the heat source, is to deform at least partially to match a shape of the heat source. The compressible mechanism within the vapor chamber (750) may moderate the deformation of the second side.