公开(公告)号：US20220110214A1

公开(公告)日：2022-04-07

申请号：US17550746

申请日：2021-12-14

Applicant: Intel Corporation

Inventor： Martin M. Chang ,  Tin Poay Chuah ,  Eng Huat Goh ,  Chu Aun Lim ,  Min Suet Lim

IPC: H05K1/18 ,  H05K1/11 ,  H05K1/14 ,  H05K1/02 ,  H05K3/30

Abstract: An apparatus comprising a package comprising a first side to interface with at least one chip; and a second side to interface with a circuit board, the second side opposite to the first side, wherein the second side comprises a non-stepped portion comprising a first plurality of conductive contacts; and a stepped portion that protrudes from the non-stepped portion, the stepped portion comprising a second plurality of conductive contacts.

公开(公告)号：US20250008685A1

公开(公告)日：2025-01-02

申请号：US18216049

申请日：2023-06-29

Applicant: Intel Corporation

Inventor： Jeff Ku ,  Nirmala Bailur ,  Min Suet Lim ,  Tongyan Zhai ,  Chee Chun Yee ,  Ruander Cardenas ,  Lance Lin ,  Eng Huat Goh ,  Javed Shaikh ,  Jun Liao ,  Kavitha Nagarajan ,  Tin Poay Chuah ,  Martin M. Chang ,  Shantanu D. Kulkarni ,  Telesphor Kamgaing

IPC: H05K7/20 ,  F04D19/00 ,  F04D29/52 ,  G06F1/20

Abstract: Systems, apparatus, articles of manufacture, and methods are disclosed for cooling electronic devices. An example apparatus includes a fan module for an electronic device. The fan module includes a first cover; a second cover; an input/output (IO) board adjacent the second cover, the second cover and IO board beneath the first cover; and a fan between the first cover and the second cover, the fan to operate above the second cover and a portion of the IO board.