公开(公告)号：US20240327679A1

公开(公告)日：2024-10-03

申请号：US18194395

申请日：2023-03-31

Applicant: Intel Corporation

Inventor： Yuan MENG ,  Elizabeth NOFEN ,  Zhixin XIE ,  Dingying XU ,  Seyed Hadi ZANDAVI

IPC: C09J7/38 ,  C09J11/04 ,  H05K13/00

CPC classification number: C09J7/38 ,  C09J11/04 ,  H05K13/0069 ,  C09J2301/408

Abstract: This disclosure describes systems, methods, and devices related to switchable adhesion. A switchable adhesion system may comprise a shape memory polymer having a shaped surface to enhance adhesion using a trigger and a force applied to the shape memory polymer, wherein the trigger is applied to alter characteristics of the shape memory polymer, and wherein the force is applied to deform the shape memory polymer while the trigger is applied. The system may further comprise a media tray connected to the shape memory polymer.

公开(公告)号：US20240222216A1

公开(公告)日：2024-07-04

申请号：US18091034

申请日：2022-12-29

Applicant: Intel Corporation

Inventor： Zhixin XIE ,  Jung Kyu HAN ,  Gang DUAN

IPC: H01L23/31 ,  G02B6/42 ,  H01L21/56 ,  H01L23/00 ,  H01L23/29 ,  H01L25/065 ,  H01L25/10

CPC classification number: H01L23/3135 ,  G02B6/4239 ,  H01L21/563 ,  H01L21/565 ,  H01L23/295 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L25/0655 ,  H01L25/105 ,  H01L2224/1601 ,  H01L2224/16225 ,  H01L2224/3201 ,  H01L2224/32054 ,  H01L2224/32057 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/1811 ,  H01L2924/1815 ,  H01L2924/182 ,  H01L2924/186 ,  H01L2924/3511

Abstract: Embodiments disclosed herein include electronic packages. In an embodiment, the electronic package comprises a package substrate with a die coupled to the package substrate by a plurality of interconnects. In an embodiment, a first layer is on the package substrate surrounding the die, and a second layer is over and around the die. In an embodiment, the second layer underfills the plurality of interconnects, and the second layer has a different material composition than the first layer.

公开(公告)号：US20240188223A1

公开(公告)日：2024-06-06

申请号：US18060581

申请日：2022-12-01

Applicant: Intel Corporation

Inventor： Zhixin XIE ,  Jung Kyu HAN ,  Gang DUAN

IPC: H05K3/28 ,  B29C70/70

CPC classification number: H05K3/284 ,  B29C70/70 ,  B29L2031/3406

Abstract: There may be provided an apparatus. The apparatus may include a first dispensing unit and a second dispensing unit. The apparatus may further include a connection assembly coupled to the first dispensing unit and the second dispensing unit in a manner such that a position of the first dispensing unit or the second dispensing unit relative to the other of said first dispensing unit or second dispensing unit may be adjustable via the connection assembly.

公开(公告)号：US20250144857A1

公开(公告)日：2025-05-08

申请号：US18500132

申请日：2023-11-02

Applicant: Intel Corporation

Inventor： Zhixin XIE ,  Yi LI ,  Jesse JONES ,  Gang DUAN ,  Andrew JIMENEZ ,  Jung Kyu HAN ,  Yekan WANG

IPC: B29C45/14 ,  B29C45/26

Abstract: Various aspects may provide a molding system. The molding system may include a molding unit which includes a first mold panel and a second mold panel. The first mold panel and the second mold panel may include a mold cavity which surrounds a semiconductor workpiece along a side surface of the semiconductor workpiece, with the first mold panel and the second mold panel engaged with the semiconductor workpiece. Various aspects may also provide a molding method which utilize the molding system.

公开(公告)号：US20250112136A1

公开(公告)日：2025-04-03

申请号：US18374937

申请日：2023-09-29

Applicant: Intel Corporation

Inventor： Bohan SHAN ,  Jesse JONES ,  Zhixin XIE ,  Bai NIE ,  Shaojiang CHEN ,  Joshua STACEY ,  Mitchell PAGE ,  Brandon C. MARIN ,  Jeremy D. ECTON ,  Nicholas S. HAEHN ,  Astitva TRIPATHI ,  Yuqin LI ,  Edvin CETEGEN ,  Jason M. GAMBA ,  Jacob VEHONSKY ,  Jianyong MO ,  Makoyi WATSON ,  Shripad GOKHALE ,  Mine KAYA ,  Kartik SRINIVASAN ,  Haobo CHEN ,  Ziyin LIN ,  Kyle ARRINGTON ,  Jose WAIMIN ,  Ryan CARRAZZONE ,  Hongxia FENG ,  Srinivas Venkata Ramanuja PIETAMBARAM ,  Gang DUAN ,  Dingying David XU ,  Hiroki TANAKA ,  Ashay DANI ,  Praveen SREERAMAGIRI ,  Yi LI ,  Ibrahim EL KHATIB ,  Aaron GARELICK ,  Robin MCREE ,  Hassan AJAMI ,  Yekan WANG ,  Andrew JIMENEZ ,  Jung Kyu HAN ,  Hanyu SONG ,  Yonggang Yong LI ,  Mahdi MOHAMMADIGHALENI ,  Whitney BRYKS ,  Shuqi LAI ,  Jieying KONG ,  Thomas HEATON ,  Dilan SENEVIRATNE ,  Yiqun BAI ,  Bin MU ,  Mohit GUPTA ,  Xiaoying GUO

IPC: H01L23/498 ,  H01L23/15

Abstract: Embodiments disclosed herein include apparatuses with glass core package substrates. In an embodiment, an apparatus comprises a substrate with a first surface and a second surface opposite from the first surface. A sidewall is between the first surface and the second surface, and the substrate comprises a glass layer. In an embodiment, a via is provided through the substrate between the first surface and the second surface, and the via is electrically conductive. In an embodiment, a layer in contact with the sidewall of the substrate surrounds a perimeter of the substrate.

公开(公告)号：US20240210634A1

公开(公告)日：2024-06-27

申请号：US18089501

申请日：2022-12-27

Applicant: Intel Corporation

Inventor： Zhixin XIE ,  Jung Kyu HAN ,  Gang DUAN

IPC: G02B6/42 ,  G02B1/04 ,  G02B3/00

CPC classification number: G02B6/4206 ,  G02B1/041 ,  G02B3/0087 ,  G02B6/4214 ,  G02B6/428

Abstract: Embodiments disclosed herein include a package substrate. In an embodiment, the package substrate comprises a substrate and an optical fiber in the substrate. In an embodiment, a lens is optically coupled to the optical fiber. In an embodiment, the lens is a gradient index (GRIN) lens.