公开(公告)号：US20250113434A1

公开(公告)日：2025-04-03

申请号：US18374617

申请日：2023-09-28

Applicant: Intel Corporation

Inventor： Bai NIE ,  Mitchell PAGE ,  Junxin WANG ,  Srinivas Venkata Ramanuja PIETAMBARAM ,  Haifa HARIRI ,  Nicholas S. HAEHN ,  Astitva TRIPATHI ,  Yuqin LI ,  Hongxia FENG ,  Haobo CHEN ,  Bohan SHAN ,  Hiroki TANAKA ,  Leonel R. ARANA ,  Yonggang Yong LI

IPC: H05K1/02 ,  H01L23/15 ,  H01L23/498 ,  H05K1/03 ,  H05K1/11

Abstract: Embodiments disclosed herein include package substrates with a glass core. In an embodiment, an apparatus comprises a substrate with a first surface and a second surface opposite from the first surface, and the substrate is a solid glass layer. In an embodiment, an opening is provided through a thickness of the substrate, where the opening comprises a sidewall that is non-orthogonal with the first surface of the substrate. In an embodiment a corner at a junction between the sidewall and the first surface is rounded. In an embodiment, a via is provided in the opening, where the via is electrically conductive.

公开(公告)号：US20250105119A1

公开(公告)日：2025-03-27

申请号：US18373848

申请日：2023-09-27

Applicant: Intel Corporation

Inventor： Yuqin LI ,  Jesse JONES ,  Sandrine LTEIF ,  Srinivas V. PIETAMBARAM ,  Suresh Tanaji NARUTE ,  Pramod MALATKAR ,  Gang DUAN ,  Khaled AHMED

IPC: H01L23/498 ,  H01L21/48 ,  H01L23/00 ,  H01L23/15

Abstract: Embodiments disclosed herein include glass cores with vias that are lined by a self-healing liner. In an embodiment, an apparatus comprises a substrate that comprises a solid glass layer with an opening through a thickness of the substrate. In an embodiment, a liner is in contact with a sidewall of the opening, where the liner comprises a polymer matrix with capsules distributed through the polymer matrix. In an embodiment, each capsule comprises a shell, and a core within the shell. In an embodiment, the core comprises an organic material. In an embodiment, a via is in the opening and in contact with the liner, and the via is electrically conductive.

公开(公告)号：US20250112136A1

公开(公告)日：2025-04-03

申请号：US18374937

申请日：2023-09-29

Applicant: Intel Corporation

Inventor： Bohan SHAN ,  Jesse JONES ,  Zhixin XIE ,  Bai NIE ,  Shaojiang CHEN ,  Joshua STACEY ,  Mitchell PAGE ,  Brandon C. MARIN ,  Jeremy D. ECTON ,  Nicholas S. HAEHN ,  Astitva TRIPATHI ,  Yuqin LI ,  Edvin CETEGEN ,  Jason M. GAMBA ,  Jacob VEHONSKY ,  Jianyong MO ,  Makoyi WATSON ,  Shripad GOKHALE ,  Mine KAYA ,  Kartik SRINIVASAN ,  Haobo CHEN ,  Ziyin LIN ,  Kyle ARRINGTON ,  Jose WAIMIN ,  Ryan CARRAZZONE ,  Hongxia FENG ,  Srinivas Venkata Ramanuja PIETAMBARAM ,  Gang DUAN ,  Dingying David XU ,  Hiroki TANAKA ,  Ashay DANI ,  Praveen SREERAMAGIRI ,  Yi LI ,  Ibrahim EL KHATIB ,  Aaron GARELICK ,  Robin MCREE ,  Hassan AJAMI ,  Yekan WANG ,  Andrew JIMENEZ ,  Jung Kyu HAN ,  Hanyu SONG ,  Yonggang Yong LI ,  Mahdi MOHAMMADIGHALENI ,  Whitney BRYKS ,  Shuqi LAI ,  Jieying KONG ,  Thomas HEATON ,  Dilan SENEVIRATNE ,  Yiqun BAI ,  Bin MU ,  Mohit GUPTA ,  Xiaoying GUO

IPC: H01L23/498 ,  H01L23/15

Abstract: Embodiments disclosed herein include apparatuses with glass core package substrates. In an embodiment, an apparatus comprises a substrate with a first surface and a second surface opposite from the first surface. A sidewall is between the first surface and the second surface, and the substrate comprises a glass layer. In an embodiment, a via is provided through the substrate between the first surface and the second surface, and the via is electrically conductive. In an embodiment, a layer in contact with the sidewall of the substrate surrounds a perimeter of the substrate.