公开(公告)号：US20200328182A1

公开(公告)日：2020-10-15

申请号：US16915282

申请日：2020-06-29

Applicant: Intel IP Corporation

Inventor： Bernd WAIDHAS ,  Georg SEIDEMANN ,  Andreas WOLTER ,  Thomas WAGNER ,  Stephan Stoeckl ,  Laurent MILLOU

IPC: H01L25/065 ,  H01L23/538 ,  H01L23/498 ,  H01L23/00 ,  H01L21/56 ,  H01L25/00 ,  H01L21/683

Abstract: An embedded-bridge substrate connector apparatus includes a patterned reference layer to which a first module and a subsequent module are aligned and the two modules are mated at the patterned reference layer. At least one module includes a silicon bridge connector that bridges to two devices, through the patterned reference layer, to the mated module.