公开(公告)号：US20170284636A1

公开(公告)日：2017-10-05

申请号：US15087477

申请日：2016-03-31

Applicant: Intel IP Corporation

Inventor： Marc Stephan Dittes ,  Sven Albers ,  Christian Georg Geissler ,  Andreas Wolter ,  Klaus Reingruber ,  Georg Seidemann ,  Thomas Wagner ,  Richard Patten

IPC: F21V11/00 ,  F21V23/00 ,  H01L33/58 ,  H01L33/54 ,  H01L33/48 ,  H01L33/62

CPC classification number: H01L25/167 ,  H01L23/3128 ,  H01L2224/16225 ,  H01L2224/73257 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00012

Abstract: A microelectronic package is described with an illuminated backside exterior. In one example, the package has a package substrate, a die attached to the package substrate, a cover over the die and the package substrate, a lamp, and a screen over the die, externally visible and optically coupled to the lamp so that when the lamp is illuminated the illumination is externally visible through the screen.

公开(公告)号：US10411000B2

公开(公告)日：2019-09-10

申请号：US15087477

申请日：2016-03-31

Applicant: Intel IP Corporation

Inventor： Marc Stephan Dittes ,  Sven Albers ,  Christian Georg Geissler ,  Andreas Wolter ,  Klaus Reingruber ,  Georg Seidemann ,  Thomas Wagner ,  Richard Patten

IPC: F21V15/00 ,  H01L25/16 ,  H01L23/31

Abstract: A microelectronic package is described with an illuminated backside exterior. In one example, the package has a package substrate, a die attached to the package substrate, a cover over the die and the package substrate, a lamp, and a screen over the die, externally visible and optically coupled to the lamp so that when the lamp is illuminated the illumination is externally visible through the screen.