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    EXPANDED POLYPROPYLENE RESIN BEADS AND EXPANDED BEAD MOLDING
    2.
    发明专利
    EXPANDED POLYPROPYLENE RESIN BEADS AND EXPANDED BEAD MOLDING 未知

    公开(公告)号：SG176841A1

    公开(公告)日：2012-01-30

    申请号：SG2011092509

    申请日：2010-06-03

    Applicant: JSP CORP

    Inventor： SAKAGUCHI MASAKAZU ,  NISHIJIMA KOUKI ,  OIKAWA MASAHARU

    Abstract: Disclosed are expanded polypropylene resin beads which enable the heat molding of expanded polypropylene resin beads at low steam pressure and can provide an expanded mold with sufficient rigidity and heat resistance. The multilayer expanded resin beads are formed by expanding multilayer resin beads comprising a core layer formed from a polypropylene resin and a coating layer formed from a different polypropylene resin to that which forms the core layer. The multilayer expanded resin beads can be molded in-mold at a steam pressure lower than the steam pressure for molding single-layer expanded beads which would result from expanding the single layer resin beads made from the polypropylene resin which forms the core layer. The coating layer to core layer resin weight ratio in the aforementioned multi- layer resin beads is not less than 0.001 and not greater than 0.040 and the expansion ratio of the expanded beads, the average value of the thickness of the coating layer of the expanded beads, calculated based on the coating weight ratio of the multi-layer resin beads, is not less than 0.1[err]m and not greater than 3.0[err]m.

    EXPANDED POLYPROPYLENE RESIN BEADS AND EXPANDED BEAD MOLDING
    3.
    发明公开
    EXPANDED POLYPROPYLENE RESIN BEADS AND EXPANDED BEAD MOLDING 有权
    拉伸聚丙烯树脂颗粒及形成拉伸珠

    公开(公告)号：EP2447311A4

    公开(公告)日：2013-05-29

    申请号：EP10791792

    申请日：2010-06-03

    Applicant: JSP CORP

    Inventor： SAKAGUCHI MASAKAZU ,  NISHIJIMA KOUKI ,  OIKAWA MASAHARU

    IPC: C08J9/00 ,  B29C44/34 ,  C08J9/12 ,  C08J9/18 ,  C08J9/224 ,  C08J9/232

    CPC classification number: C08J9/0061 ,  B29C44/3461 ,  C08J9/122 ,  C08J9/18 ,  C08J9/232 ,  C08J2201/03 ,  C08J2203/06 ,  C08J2323/12 ,  C08J2423/12

    Abstract: Disclosed are expanded polypropylene resin beads which enable the heat molding of expanded polypropylene resin beads at low steam pressure and can provide an expanded mold with sufficient rigidity and heat resistance. The multilayer expanded resin beads are formed by expanding multilayer resin beads comprising a core layer formed from a polypropylene resin and a coating layer formed from a different polypropylene resin to that which forms the core layer. The multilayer expanded resin beads can be molded in-mold at a steam pressure lower than the steam pressure for molding single-layer expanded beads which would result from expanding the single layer resin beads made from the polypropylene resin which forms the core layer. The coating layer to core layer resin weight ratio in the aforementioned multi-layer resin beads is not less than 0.001 and not greater than 0.040 and the expansion ratio of the expanded beads, the average value of the thickness of the coating layer of the expanded beads, calculated based on the coating weight ratio of the multi-layer resin beads, is not less than 0.1µm and not greater than 3.0µm.

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