2.
    发明专利
    未知

    公开(公告)号:AT553149T

    公开(公告)日:2012-04-15

    申请号:AT08752701

    申请日:2008-05-14

    Applicant: JSP CORP

    Abstract: A polypropylene resin foamed bead from which a foamed bead molded article excelling in appearance, heat resistance and mechanical properties can be obtained at the molding temperature lower than that for conventional polypropylene resin foamed beads; and a foamed bead molded article obtained by molding the same. The polypropylene resin foamed bead is characterized by having such a crystal structure that in the first DSC curve obtained when the temperature of the foamed bead sample is raised from ordinary temperature to 200°C at a temperature rising rate of 2°C/min by a differential scanning calorimetry, there appear a main endothermic peak of 100° to 140°C endothermic peak apex temperature exhibiting 70 to 95% endothermic peak calorific value based on the total endothermic peak calorific value and two or more endothermic peaks exhibited on the high temperature side with respect to the main endothermic peak.

    3.
    发明专利
    未知

    公开(公告)号:AT500945T

    公开(公告)日:2011-03-15

    申请号:AT08021413

    申请日:2008-12-10

    Applicant: JSP CORP

    Abstract: Expanded polypropylene resin beads having a melting point of not less than 120°C but less than 140°C, the melting point being determined from a DSC curve obtained by heat flux differential scanning calorimetry in accordance with JIS K7121-1987 in which a sample of 1 to 3 mg of the expanded polypropylene resin beads is heated to 200°C at a heating rate of 10°C/minute, then cooled to 30°C at a rate of 10°C/minute, and again heated from 30°C to 200°C at a heating rate of 10°C/minute to obtain the DSC curve. The expanded polypropylene resin beads has an apparent density Á 1 before heating and an apparent density Á 2 after being heated for 10 seconds with steam at a temperature higher by 5°C than the melting point thereof, wherein a ratio of Á 1 to Á 2 is not greater than 1.5.

Patent Agency Ranking