Abstract:
An object of the invention is to provide an adherend recovery method capable of recovering adherends such as cells no matter the types of adherends. [Solution] An adherend recovery method for recovering an adherend from a support includes exposing a stack disposed on the support, the stack including a photosensitive gas generation layer, an adhesive layer and the adherend in this order on the support, generating a gas from the photosensitive gas generation layer by the exposure to separate the support and the stack from each other by the action of the gas, and recovering the adherend from the support by recovering the stack separated.
Abstract:
PROBLEM TO BE SOLVED: To provide a curable composition and a cured film excellent in preservation stability.SOLUTION: There is provided a curable composition containing a compound [A] represented by the following formula (1) and a compound [B] having an epoxy group. The compound [A] is preferably represented by the following formula (2). In addition, Rin the formula (2) is an oxygen atom, Ris a nitro group, m is 1 or Ris a sulfur atom and m is preferably 0. Further, the compound [B] having an epoxy group is preferably a polymer having a structural unit derived from at least one compound selected from the group consisting of (b1) an unsaturated carboxylic acid and an unsaturated carboxylic anhydride and a structural unit derived from (b2) an epoxy group-containing unsaturated compound.
Abstract:
PROBLEM TO BE SOLVED: To provide a compound having high radiation-sensitivity when used as a photopolymerization initiator, and to provide a radiation-sensitive composition which gives a cured film having high radiation-sensitivity and excellent solvent resistance. SOLUTION: The composition is represented by formula (1), wherein R 1 , R 2 , R 3 , and R 4 each independently represent a hydrogen atom, a halogen atom, a cyano group or a nitro group. R 5 represents a cyano group or a phenyl group in which some or all of hydrogen atoms are substituted with 1-12C alkoxy groups. R 6 and R 7 each independently represent a hydrogen atom, a 1-6C alkyl group, a cyclopentyl group, a cyclohexyl group or a nitrogen-containing heterocyclic group. COPYRIGHT: (C)2011,JPO&INPIT
Abstract translation:要解决的问题:提供当用作光聚合引发剂时具有高辐射敏感性的化合物,并提供具有高辐射敏感性和优异耐溶剂性的固化膜的辐射敏感性组合物。 解决方案:组合物由式(1)表示,其中R 1,R 2,R 2,R 3,SP 3和/或SP > 4 SP>各自独立地表示氢原子,卤素原子,氰基或硝基。 R 5表示其中部分或全部氢原子被1-12个C 1烷氧基取代的氰基或苯基。 R 6和R 7各自独立地表示氢原子,1-6C烷基,环戊基,环己基或含氮杂环基。 版权所有(C)2011,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a radiation-sensitive resin composition having both storage stability and low-temperature curability and sufficient pattern forming capability; a cured film being formed using such a radiation-sensitive resin composition and being excellent in demand characteristics such as heat resistance and compression characteristics; and a formation method of such a cured film.SOLUTION: A radiation-sensitive resin composition contains [A] an alkali-soluble resin, [B] a polymerizable compound having an ethylenically unsaturated bond, [C] a radiation-sensitive polymerization initiator and [D] a compound represented by the formula (1), where the [A] alkali-soluble resin has an epoxy group or further contains [E] an epoxy compound.
Abstract:
PROBLEM TO BE SOLVED: To provide a radiation-sensitive resin composition having high sensitivity to radiation and having such a development margin that desirable pattern configuration is formed even when the optimum development time is exceeded in the development step. SOLUTION: The radiation-sensitive resin composition includes [A] an alkali-soluble resin, [B] a 1,2-quinonediazide compound, and [C] a compound having at least one ethylenically unsaturated bond per molecule and having a skeleton derived from trimethylolpropane or pentaerythritol or an isocyanurate skeleton. The alkali-soluble resin [A] may be a copolymer of unsaturated compounds including (a1) an unsaturated carboxylic acid and/or unsaturated carboxylic anhydride and (a2) an epoxy group-containing unsaturated compound. COPYRIGHT: (C)2010,JPO&INPIT