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公开(公告)号：DE69915900T3
公开(公告)日：2008-06-26
申请号：DE69915900
申请日：1999-01-19
Applicant: JSR CORP
Inventor： KODAMA KAZUHISA , MIZUNO YOSHIHISA , NAKANISHI HIDEO , YAMASHITA SATOSHI , HASEGAWA KOU , YASUDA KENJI
Abstract: A thermoplastic elastomer composition prepared by dynamically treating with heat (a) an oil-extended ethylene-based copolymer rubber which comprises an ethylene-based copolymer rubber with an intrisic viscosity Ä eta Ü in the range from 4.3 to 6.8 dl/g when measured at 135 DEG C in decalin and a mineral oil softening agent and (b) an olefin-based resin, in the presence of a crosslinking agent. The composition exhibits well-balanced and excellent elasticity recoverability and moldability, and can produce molded articles with superior appearance.
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公开(公告)号：DE60219113D1
公开(公告)日：2007-05-10
申请号：DE60219113
申请日：2002-09-24
Applicant: JSR CORP
Inventor： HASEGAWA KOU , HOSAKA YUKIO
IPC: B24B37/20 , B24B37/22 , B24B37/24 , B24D3/00 , B24D13/12 , B24D13/14 , H01L21/304 , H01L21/306
Abstract: An object of the present invention is to provide a polishing pad for a semiconductor wafer which can perform a stable polishing while preventing a polishing layer from floating up from a supporting layer and a surface of a polishing pad from bending during polishing using a polishing pad having a multi-layered structure of a polishing layer and a supporting layer. The polishing pad (1) of the present invention is characterized in that it is comprising a supporting layer (12) which is a non-porous elastic body and a polishing layer (11) which is laminated on one surface of the supporting layer. Shore D hardness of the polishing layer is preferably (35) or more, and hardness of the supporting layer is preferably lower than that of the polishing layer.
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公开(公告)号：DE602005000252T2
公开(公告)日：2007-06-06
申请号：DE602005000252
申请日：2005-04-27
Applicant: JSR CORP
Inventor： HOSAKA YUKIO , SHIHO HIROSHI , MIYAUCHI HIROYUKI , OKAMOTO TAKAHIRO , HASEGAWA KOU , KAWAHASHI NOBUO
Abstract: There is provided a chemical mechanical polishing pad (1) containing a polishing substrate having a polishing surface and a light-transmitting member (12) fused to the polishing substrate. The sectional form of the light-transmitting member when it is cut with a plane parallel to the polishing surface is elliptic with a value obtained by dividing its long diameter by its short diameter of more than 1.The pad is capable of transmitting end-point detection light without reducing its polishing efficiency in polishing a semiconductor wafer.
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公开(公告)号：DE602005000252D1
公开(公告)日：2006-12-28
申请号：DE602005000252
申请日：2005-04-27
Applicant: JSR CORP
Inventor： HOSAKA YUKIO , SHIHO HIROSHI , MIYAUCHI HIROYUKI , OKAMOTO TAKAHIRO , HASEGAWA KOU , KAWAHASHI NOBUO
Abstract: There is provided a chemical mechanical polishing pad (1) containing a polishing substrate having a polishing surface and a light-transmitting member (12) fused to the polishing substrate. The sectional form of the light-transmitting member when it is cut with a plane parallel to the polishing surface is elliptic with a value obtained by dividing its long diameter by its short diameter of more than 1.The pad is capable of transmitting end-point detection light without reducing its polishing efficiency in polishing a semiconductor wafer.
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公开(公告)号：DE602004001268D1
公开(公告)日：2006-08-03
申请号：DE602004001268
申请日：2004-04-23
Applicant: JSR CORP
Inventor： SHIHO HIROSHI , OKAMOTO TAKAHIRO , HASEGAWA KOU , KAWAHASHI NOBUO
Abstract: A polishing pad comprises crosslinked diene elastomer (70-99.9 mass%) and polymer having acid anhydride structure (0.1-30 mass%). The polishing pad has a specific gravity of 0.9-1.2. An independent claim is also included for a chemical mechanical polishing method including flattening surface of a material to be polished with the above polishing pad.
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Patent Agency Ranking
公开(公告)号：DE69915900T2
公开(公告)日：2005-07-28
申请号：DE69915900
申请日：1999-01-19
Applicant: JSR CORP
Inventor： KODAMA KAZUHISA , MIZUNO YOSHIHISA , NAKANISHI HIDEO , YAMASHITA SATOSHI , HASEGAWA KOU , YASUDA KENJI
Abstract: A thermoplastic elastomer composition prepared by dynamically treating with heat (a) an oil-extended ethylene-based copolymer rubber which comprises an ethylene-based copolymer rubber with an intrisic viscosity Ä eta Ü in the range from 4.3 to 6.8 dl/g when measured at 135 DEG C in decalin and a mineral oil softening agent and (b) an olefin-based resin, in the presence of a crosslinking agent. The composition exhibits well-balanced and excellent elasticity recoverability and moldability, and can produce molded articles with superior appearance.
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公开(公告)号：DE60132399T2
公开(公告)日：2009-01-15
申请号：DE60132399
申请日：2001-05-30
Applicant: JSR CORP
Inventor： OGAWA TOSHIHIRO , HASEGAWA KOU , KAWAHASHI NOBUO
Abstract: An object of the invention is to provide a polishing pad having the excellent slurry retaining properties and the large removal rate and a composition for a polishing pad which can form such the polishing pad. A composition for polishing pad of the invention is comprising a water-insoluble matrix material containing a crosslinked polymer and a water-soluble particle dispersed in the water-insoluble matrix material. The elongation remaining after breaking is 100% or smaller when a test piece comprising the water-insoluble matrix material is broken at 80 DEG C according to JIS K 6251. A polishing pad of the invention is that at least a part of the polishing pad comprises the composition for polishing pad.
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公开(公告)号：DE60132413T2
公开(公告)日：2009-01-08
申请号：DE60132413
申请日：2001-10-23
Applicant: JSR CORP
Inventor： HASEGAWA KOU , KOUMURA TOMOO , KOBAYASHI YUTAKA
IPC: B24D3/32 , B24B37/20 , B24B37/24 , C08J5/14 , C08L9/00 , C08L101/02 , C09K3/14 , H01L21/304
Abstract: It is an object of the invention to provide a composition for forming a polishing pad comprising substances having specific functional groups exhibiting excellent hydrophilic properties and the like, a crosslinked body for polishing pad as well as a polishing pad with excellent water resisting and durability which exhibits excellent polishing performance including a high removal rate and method for producing thereof. The composition for forming a polishing pad comprises a crosslinkable elastomer having no carboxyl, amino, hydroxyl, epoxy, sulfonic acid and phosphoric acid groups, and a water-insoluble substance having at least one functional group selected from the group consisting of carboxyl, amino, hydroxyl, epoxy, sulfonic acid and phosphoric acid groups. And a water-soluble substance such as cyclodextrin may be contained. A polishing pad can be manufactured using the composition above or the crosslinked body for polishing pad, and porous polishing pads may also be obtained.
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公开(公告)号：DE60131080T2
公开(公告)日：2008-07-31
申请号：DE60131080
申请日：2001-05-29
Applicant: JSR CORP
Inventor： HASEGAWA KOU , SATOU HOZUMI , ISHIKAWA OSAMU , HOSAKA YUKIO
Abstract: An object of the present invention is to provide a polishing body, wherein the abrasive in the polishing body are extremely dispersed well, which provides stable polishing performance in the polishing process, and which can effectively reduce the occurrence of scratches even in a case a large quantity of the abrasive are contained. A polishing part constituting the polishing body in the invention is produced obtained by loading predetermined amounts of butadiene, styrene, methyl methacrylate, itaconic acid, acrylic acid, alpha -methylstyrenedimer, and t-dodecylmercaptan in an autoclave, making the mixture react for 16 hours at 75 DEG C to obtain an emulsion wherein a copolymer is dispersed, adjusting this emulsion to pH8.5, incorporating cerium oxide powder with an average primary particle diameter of 0.3 mu m and stirring to obtain an aqueous dispersion, drying this aqueous dispersion by spreading it thinly across a film, and mold pressing the dried product obtained. The above-mentioned polishing part may have a crosslinked structure. The polishing body in the invention can be used favorably in a polishing pad and the like, for polishing the surface of a semiconductor wafer or the like.
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公开(公告)号：DE60132399D1
公开(公告)日：2008-03-06
申请号：DE60132399
申请日：2001-05-30
Applicant: JSR CORP
Inventor： OGAWA TOSHIHIRO , HASEGAWA KOU , KAWAHASHI NOBUO
Abstract: An object of the invention is to provide a polishing pad having the excellent slurry retaining properties and the large removal rate and a composition for a polishing pad which can form such the polishing pad. A composition for polishing pad of the invention is comprising a water-insoluble matrix material containing a crosslinked polymer and a water-soluble particle dispersed in the water-insoluble matrix material. The elongation remaining after breaking is 100% or smaller when a test piece comprising the water-insoluble matrix material is broken at 80 DEG C according to JIS K 6251. A polishing pad of the invention is that at least a part of the polishing pad comprises the composition for polishing pad.
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