RADIATION-SENSITIVE RESIN COMPOSITION

    公开(公告)号:AU2002367625A1

    公开(公告)日:2003-09-04

    申请号:AU2002367625

    申请日:2002-12-13

    Applicant: JSR CORP

    Abstract: A radiation-sensitive resin composition comprising (A) an alkali-soluble resin having an unsaturated group, (B) a compound having at least one ethylenically unsaturated double bond, and (C) a radiation-induced radical polymerization initiator, wherein: the alkali-soluble resin having an unsaturated group (A) is obtained by reacting: 100 parts by weight of a copolymer comprising 1 to 40 wt% structural units derived from (a) a radically polymerizable compound having a carboxyl group; 1 to 50 wt% structural units having a phenolic hydroxyl group which are derived from (b-1) a radically polymerizable compound having a phenolic hydroxyl group or (b-2) a radically polymerizable compound having a functional group convertible into a phenolic hydroxyl group after the copolymerization, other structural units of said copolymer being derived from (c) another radically polymerizable compound; with 0.1 to 20 parts by weight of (d) a radically polymerizable compound having an epoxy group. The resin composition can form a radiation-sensitive film in a thickness greater than a deposit thickness and has a high resolution.

    RADIATION-SENSITIVE RESIN COMPOSITION
    5.
    发明公开
    RADIATION-SENSITIVE RESIN COMPOSITION 有权
    辐射敏感性树脂组合物

    公开(公告)号:EP1477848A4

    公开(公告)日:2008-01-02

    申请号:EP02790753

    申请日:2002-12-13

    Applicant: JSR CORP

    CPC classification number: G03F7/033 G03F7/405

    Abstract: A radiation-sensitive resin composition comprising (A) an alkali-soluble resin having unsaturated groups which is obtained by reacting 100 parts by weight of a copolymer comprising 1 to 40 wt% of constituent units derived from a radical -polymerizable compound (a) having a carboxyl group, 1 to 50 wt% of constituent units having phenolic hydroxyl groups which are derived from a radical-polymerizable compound (b-1) having a phenolic hydroxyl group or a radical-polymerizable compound (b-2) having a functional group which can be converted into phenolic hydroxyl after the formation of the copolymer, and the balance of constituent units derived from other radical -polymerizable compound (c) with 0.1 to 20 parts by weight of a radical-polymerizable compound (d) having an epoxy group, (B) a compound having at least one ethylenically unsaturated double bond, and (C) a polymerization initiator for radiation- initiated radical polymerization. The composition is characterized by forming a radiation-sensitive resin coating film having a thickness larger than the height of a deposit and high resolution.

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