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    3.
    发明专利
    未知

    公开(公告)号：DE69728366T2

    公开(公告)日：2005-02-24

    申请号：DE69728366

    申请日：1997-12-12

    Applicant: JSR CORP

    Inventor： SUWA MITSUHITO ,  IWASAWA HARUO ,  KAJITA TORU ,  IWANAGA SHIN-ICHIRO

    IPC: G03F7/004 ,  G03F7/038 ,  G03F7/039

    Abstract: A positive-tone or negative-tone radiation sensitive resin composition comprising (A) a photoacid generator represented by the following formula (1-1) or (1-2): wherein R , R , R , and R are an alkyl group , R and R are a hydroxyl group or -OR (wherein R is an organic group), A1 and A2 indicate a monovalent anion, a and c denote an integer of 4-7, and b and d an integer of 0-7. The positive-tone resin composition further comprises (B1) an acid-cleavable group-containing resin or (B2) an alkali-soluble resin and an alkali solubility control agent, and the negative-tone radiation sensitive resin composition further comprises (C) an alkali-soluble resin and (D) a crosslinking agent. The resin compositions are highly sensitive and exhibit superior resolution and pattern forming performance.

    4.
    发明专利
    未知

    公开(公告)号：DE69827211D1

    公开(公告)日：2004-12-02

    申请号：DE69827211

    申请日：1998-08-21

    Applicant: JSR CORP

    Inventor： IWANAGA SHIN-ICHIRO ,  KOBAYASHI EIICHI ,  TANABE TAKAYOSHI ,  KAWAGUCHI KAZUO

    IPC: G03F7/004 ,  G03F7/039

    Abstract: A radiation-sensitive resin composition comprising (A) a copolymer which comprises (a) a repeating unit (I) formed by cleavage of a carbon-carbon double bond of a monomer having one polymerizable carbon-carbon double bond and (b) a repeating unit (II) formed by cleavage of a carbon-carbon double bond of a monomer having two or more polymerizable carbon-carbon double bonds and at least one divalent group decomposed by an acid of the following formulas (1) or (2), wherein R , R , R and R are an alkyl group having 1-5 carbon atoms or an aryl group having 6-14 carbon atoms individually, said monomer having a structure in which each carbon-carbon double bond combines via said divalent group, and (B) a photoacid generator. The radiation-sensitive resin composition exhibits excellent sensitivity and resolution, fewer effect from the swing curves, excellent pattern profile, and superior heat resistance, high sensitivity to ultraviolet rays, far ultraviolet rays, X-rays, and various types of radiation such as charged particle rays, and is useful as a chemically amplified positive tone resist used in the manufacture of integrated circuit devices.

    RADIATION-SENSITIVE RESIN COMPOSITION
    5.
    发明专利
    RADIATION-SENSITIVE RESIN COMPOSITION 未知

    公开(公告)号：AU2002367625A1

    公开(公告)日：2003-09-04

    申请号：AU2002367625

    申请日：2002-12-13

    Applicant: JSR CORP

    Inventor： IWANAGA SHIN-ICHIRO ,  IWAMOTO SATOSHI ,  KIMURA TOORU ,  NISHIMURA HIROKO ,  NISHIKAWA KOJI

    IPC: G03F7/027 ,  C08F290/12 ,  G03F7/004 ,  G03F7/033 ,  G03F7/40 ,  H01L21/027 ,  H05K3/00 ,  H01L21/288

    Abstract: A radiation-sensitive resin composition comprising (A) an alkali-soluble resin having an unsaturated group, (B) a compound having at least one ethylenically unsaturated double bond, and (C) a radiation-induced radical polymerization initiator, wherein: the alkali-soluble resin having an unsaturated group (A) is obtained by reacting: 100 parts by weight of a copolymer comprising 1 to 40 wt% structural units derived from (a) a radically polymerizable compound having a carboxyl group; 1 to 50 wt% structural units having a phenolic hydroxyl group which are derived from (b-1) a radically polymerizable compound having a phenolic hydroxyl group or (b-2) a radically polymerizable compound having a functional group convertible into a phenolic hydroxyl group after the copolymerization, other structural units of said copolymer being derived from (c) another radically polymerizable compound; with 0.1 to 20 parts by weight of (d) a radically polymerizable compound having an epoxy group. The resin composition can form a radiation-sensitive film in a thickness greater than a deposit thickness and has a high resolution.

    6.
    发明专利
    未知

    公开(公告)号：DE69706029T2

    公开(公告)日：2002-06-06

    申请号：DE69706029

    申请日：1997-12-10

    Applicant: JSR CORP

    Inventor： INOMATA KATSUMI ,  AKIYAMA MASAHIRO ,  IWANAGA SHIN-ICHIRO ,  TSUJI AKIRA

    IPC: G03F7/022

    Abstract: A radiation-sensitive resin composition including an alkali soluble resin and a quinonediazide compound is provided. The quinonediazide compound has the formula (1), for example: wherein, R to R are an alkyl, cycloalkyl or aryl group; a and b are an integer of 1 to 3; D and D are independently a hydrogen atom or a 1,2-quinonediazidosulfonyl group, provided that at least one of D is a 1,2-quinonediazidosulfonyl group; A is a bonding such as single bond; and x and y are an integer of 0 to 2. The composition is suitable as a positive resist, which effectively restrains the occurrence of scum, and excellent in developability, pattern shape, sensitivity, resolution and focus latitude.

    7.
    发明专利
    未知

    公开(公告)号：AT470887T

    公开(公告)日：2010-06-15

    申请号：AT05799121

    申请日：2005-10-28

    Applicant: JSR CORP

    Inventor： ITO ATSUSHI ,  YOKOYAMA KEN-ICHI ,  INOMATA KATSUMI ,  IWANAGA SHIN-ICHIRO

    IPC: G03F7/023 ,  C08F212/08 ,  C08F212/14 ,  C08G8/38 ,  G03F7/022 ,  G03F7/075 ,  G03F7/40

    Abstract: Disclosed is a positive photosensitive insulating resin composition which comprises: (A) a copolymer comprising (A1) 10 to 99 mol% of a structural unit of the formula (1) and (A2) 90 to 1 mol% of a structural unit of the formula (2); (B) a quinone diazide group-containing compound; (C) at least one compound selected from the group consisting of (C1) an aromatic compound containing a methylol group and/or an alkoxy methyl group (except for aromatic compounds containing an amino group), (C2) an aromatic aldehyde compound, (C3) an aliphatic aldehyde compound, (C4) an alkyl-etherified amino group-containing compound and (C5) an epoxy group-containing compound; (D) a solvent; and (E) an adhesion assistant. Disclosed also is a cured product obtainable from the composition. wherein Ra and Rb are each an alkyl group having 1 to 4 carbon atoms, alkoxy group or aryl group, Rb and Rc are each hydrogen or a methyl group, n is an integer of 0 to 3 and m is an integer of 1 to 3. The cured product has excellent resolution, electrical insulating properties, thermal shock resistance, adhesion and other properties.

    10.
    发明专利
    未知

    公开(公告)号：DE69813113D1

    公开(公告)日：2003-05-15

    申请号：DE69813113

    申请日：1998-08-18

    Applicant: JSR CORP

    Inventor： KOBAYASHI EIICHI ,  SHIMIZU MAKOTO ,  TANABE TAKAYOSHI ,  IWANAGA SHIN-ICHIRO

    IPC: G03F7/004

    Abstract: Positive as well as negative radiation sensitive resin compositions that, in addition to being capable of providing excellent resolution and pattern profile, are particularly excellent in avoiding the problems of "nano-edge roughness" or "coating surface roughness". The positive type radiation sensitive resin composition comprises (A) (a) an acid-decomposable group-containing resin, or (b) an alkali-soluble resin and an alkali dissolution controller, and (B) a photoacid generator comprising "a compound that upon exposure to radiation generates a carboxylic acid having a boiling point of 150 DEG C or higher", and "a compound that upon exposure to radiation generates an acid other than a carboxylic acid". The negative type radiation sensitive resin composition comprises (C) an alkali-soluble resin, (D) across-linking agent, and the component (B) as described above.

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