THERMOSETTING RESIN COMPOSITION
    2.
    发明专利

    公开(公告)号:JP2000119472A

    公开(公告)日:2000-04-25

    申请号:JP29019198

    申请日:1998-10-13

    Applicant: JSR CORP

    Abstract: PROBLEM TO BE SOLVED: To provide thermosetting resin compositions suitable as materials for forming which meet various properties to be traditionally required as protective optical device protective film films, specifically adhesion, surface hardness, transparency, heat resistance, light-resistance, chemical resistance, water resistance and the like and can flatten the difference in the steps of color filters. SOLUTION: Thermosetting resin compositions comprise [A] a copolymer of (a1) an unsaturated carboxylic acid and/or an unsaturated carboxylic anhydride, (a2) an epoxy group-containing unsaturated compound, and (a3) an olefinic unsaturated compound other than said (a1) and (a2), [B] a polymerizable compound having an ethylenically unsaturated bond, and [C] a compound which generates a radical by heat.

    Photosensitive resin composition and method for manufacturing inorganic article using the same

    公开(公告)号:JP2004118050A

    公开(公告)日:2004-04-15

    申请号:JP2002283734

    申请日:2002-09-27

    Abstract: PROBLEM TO BE SOLVED: To provide a photosensitive resin composition which consists of a specific alkali soluble resin and a specific photosetting agent, which yield a fine inorganic article pattern having high resolution, and which permits lamination of the patterns.
    SOLUTION: The first photosensitive resin composition contains the alkali soluble resin of specific characteristics, the photosetting agent, a photopolymerization initiator, and a diluting solvent. The photosensitive resin composition is used to form the inorganic articles by further adding inorganic powder, applying the resultant composition onto a substrate surface, subjecting the substrate surface to exposure and development to form the patterns, then firing the patterns. In addition, the photosetting agent contains a compound having a urethane bond in the molecule.
    COPYRIGHT: (C)2004,JPO

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