公开(公告)号：JPH08182658A

公开(公告)日：1996-07-16

申请号：JP33959494

申请日：1994-12-28

Applicant: KAO CORP

Inventor： NAGASHIMA YOSHINAO ,  KAWAI MICHIO ,  AKASAKI SHUICHI ,  KAMIYA TETSURO ,  SAITO TAKEO

IPC: A61B5/026

Abstract: PURPOSE: To record a broad range of blood flow amount of respective deepness from a superficial site to a deep site of a skin tissue simultaneously, so as to analyze change of the blood flow in the skin tissue precisely. CONSTITUTION: Plural positions of different distances from a light transmitting part 16 are made light receiving parts 15a-15e against at least one light transmitting part 16 for making a laser beam incident into a testee and scattered light from the testee is received at each light receiving part 15a-15e and blood flow amount in each light receiving part is measured, thereby, blood flow amounts of different measuring deepnesses are recorded simultaneously, in a blood flow measuring method of laser-Doppler type by which the laser beam is made incident into the testee and scattered light in the testee is received to measure the blood flow of the testee. On this occasion, preferablly, plural light receiving parts 15a-15e are formed respectively according to the distances from the light transmitting part, and preferablly the power of laser beam made incident to the testee is varied.

公开(公告)号：JP2014130956A

公开(公告)日：2014-07-10

申请号：JP2012288770

申请日：2012-12-28

Applicant: Kao Corp ,  花王株式会社 ,  Senju Metal Ind Co Ltd ,  千住金属工業株式会社

Inventor： KAWASHITA KOICHI ,  SAITO TAKEO ,  IKEDA ATSUSHI ,  MURAOKA MANABU ,  OSHIMA DAIKI ,  TSURUTA KAICHI

IPC: H05K3/34 ,  H01L21/60 ,  H01L23/12

CPC classification number: H01L23/12 ,  H01L21/4853 ,  H01L21/563 ,  H01L23/49811 ,  H01L24/81 ,  H01L2224/131 ,  H01L2224/16237 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81193 ,  H01L2224/81815 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2924/01322 ,  H05K3/3436 ,  H05K3/3478 ,  H05K3/3484 ,  H05K2203/0338 ,  H05K2203/0425 ,  H05K2203/043 ,  H05K2203/0485 ,  H01L2224/16225 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/014

Abstract: PROBLEM TO BE SOLVED: To provide a manufacturing method in which reliability of a circuit board to which an electronic component is soldered can be improved or a method of forming a solder bump.SOLUTION: This invention relates to a method of manufacturing a circuit board to which an electronic component is joined including the following steps (a)-(e) of: (a) arranging a solder transfer sheet on a first surface having a soldering part of a circuit board so that a solder layer of the transfer sheet is opposed to the first surface; (b) selectively causing solid-phase diffusion junction between the soldering part of the circuit board and the solder layer of the transfer sheet by heating the circuit board on which the transfer sheet is arranged at the temperature lower than the solidus temperature of solder alloy under pressure; (c) obtaining the circuit board in which the solder layer is bonded to the soldering part by separating the transfer sheet and the circuit board; (d) cleaning the circuit board with a cleaning agent A; and (e) melting the solder layer by heating the circuit board at the temperature higher than the liquidus temperature of the solder alloy after applying flux to the circuit board, solidifying the solder and cleaning flux residue.

Abstract translation: 要解决的问题：提供可以改善电子部件被焊接的电路板的可靠性的制造方法或形成焊料凸块的方法。解决方案本发明涉及一种制造电路板的方法， 其包括以下步骤（a） - （e）：（a）将焊料转移片布置在具有电路板的焊接部分的第一表面上，使得转印片的焊料层相对 到第一个表面; （b）通过在低于焊料合金的固相线温度的温度下加热转印片布置的电路板，选择性地引起电路板的焊接部分和转印片的焊料层之间的固相扩散接合 压力; （c）通过分离转印片和电路板获得焊料层与焊接部分结合的电路板; （d）用清洁剂A清洁电路板; 以及（e）通过在将焊剂施加到电路板上之后，以高于焊料合金的液相线温度的温度加热电路板来熔化焊料层，固化焊料和清洁焊剂残余物。