公开(公告)号：US20250079333A1

公开(公告)日：2025-03-06

申请号：US18390626

申请日：2023-12-20

Applicant: KINSUS INTERCONNECT TECHNOLOGY CORP.

Inventor： Ting-Hao LIN ,  Chiao-Cheng CHANG ,  Chien-Wei CHANG

IPC: H01L23/00 ,  H01L23/498

Abstract: An anti-warpage reinforced carrier includes a substrate, a plurality of rigid insulating plates, a plurality of metal posts, a resin layer, a first circuit layer, and a second circuit layer. The rigid insulating plates are arranged on the positioning areas on the substrate. The metal posts are in the second through holes penetrating through the rigid insulating plate. The resin layer covers the rigid insulating plates and the upper surface of the substrate, and includes a plurality of openings. The first circuit layer is on the resin layer and in the openings, and is connected to the metal posts. The second circuit layer is on a lower surface of the substrate and in the first through holes penetrating through the substrate, and is connected to the metal posts. By embedding rigid insulating plates therein, the anti-warpage reinforced carrier provides thermal stability, and is suitable for applications in advanced chip packaging.