公开(公告)号：US09198296B1

公开(公告)日：2015-11-24

申请号：US14590235

申请日：2015-01-06

Applicant: KINSUS INTERCONNECT TECHNOLOGY CORP.

Inventor： Ting-Hao Lin ,  Yu-Te Lu ,  Fu-Song Chen

IPC: H05K1/18 ,  H05K1/03 ,  H05K1/11 ,  H05K1/02

CPC classification number: H05K1/187 ,  H05K1/0213 ,  H05K1/0298 ,  H05K1/115 ,  H05K1/183 ,  H05K1/185 ,  H05K2201/0376

Abstract: A double sided board with buried element and a method for manufacturing the same are disclosed. At least one buried element is fixed on a dielectric layer and embedded in an insulation layer. First and second electrical circuits are formed on upper and lower surfaces of the insulation layer, respectively. At least one through-hole is formed in the insulation layer and filled with a conductive layer to electrically connect the first and the second electrical circuits. The dielectric layer beneath the buried element and the insulation layer above the buried element are provided with at least one opening, respectively, which is filled with the conductive layer, thereby connecting the conductive layer and external circuits or electrical elements. Additionally, the first and second electrical circuits are covered with first and second solder masks, respectively, so as to avoid environmental effect and improve preciseness of the circuits.

Abstract translation: 公开了一种具有埋设元件的双面板及其制造方法。 至少一个埋入元件固定在电介质层上并嵌入绝缘层中。 第一和第二电路分别形成在绝缘层的上表面和下表面上。 在绝缘层中形成至少一个通孔，并填充有导电层以电连接第一和第二电路。 掩埋元件下面的绝缘层和掩埋元件上方的绝缘层分别设置有至少一个开口，其中填充有导电层，由此连接导电层和外部电路或电气元件。 此外，第一和第二电路分别被第一和第二焊接掩模覆盖，以避免环境影响并提高电路的精度。