公开(公告)号：US20160181188A1

公开(公告)日：2016-06-23

申请号：US14572904

申请日：2014-12-17

Applicant: KINSUS INTERCONNECT TECHNOLOGY CORP.

Inventor： TING-HAO LIN ,  CHIAO-CHENG CHANG ,  YI-NUNG LIN

IPC: H01L23/498

CPC classification number: H01L23/49827 ,  H01L23/49816 ,  H01L23/49833 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/0002 ,  H01L2924/15311 ,  H01L2924/00

Abstract: An ameliorated compound carrier board structure of Flip-Chip Chip-Scale Package has the insulating layer between the carrier board and the substrate in the prior art replaced by an anisotropic conductive film or materials with similar structure. The anisotropic conductive film has conductive particles therein to replace the conductive openings on the insulating layer in the prior art. When compressing the substrate onto the carrier board, the bottom surface of the second electrode pads are compressing the corresponding conductive particles on the second electrical contact pads, causing which to burst, therefore forming high-density compressed areas that conduct the second electrode pads and the second electrical contact pads; the conductive particles outside the high-density compressed area are not burst, forming an insulating film between the substrate and the carrier board: in other words, the anisotropic conductive film provides conduction in a Z direction. The structure can avoid the inaccuracies of distance and size of the conductive openings and the inaccuracy of the contact between the second electrode pads and the second electrical contact pads.

Abstract translation: 翻转芯片尺寸封装的改进的复合载体板结构在现有技术中在载体板和衬底之间具有由各向异性导电膜或具有相似结构的材料代替的绝缘层。 各向异性导电膜在其中具有导电颗粒以替代现有技术中的绝缘层上的导电开口。 当将衬底压缩到载体板上时，第二电极焊盘的底表面压缩第二电接触焊盘上相应的导电颗粒，从而使其破裂，从而形成传导第二电极焊盘的高密度压缩区域 第二电接触垫; 高密度压缩区域外的导电粒子不会突发，在基板和载板之间形成绝缘膜：换句话说，各向异性导电膜在Z方向上提供导电。 该结构可以避免导电开口的距离和尺寸的不准确以及第二电极焊盘和第二电接触焊盘之间的接触的不准确性。

公开(公告)号：US20150014031A1

公开(公告)日：2015-01-15

申请号：US13938335

申请日：2013-07-10

Applicant: KINSUS INTERCONNECT TECHNOLOGY CORP.

Inventor： TING-HAO LIN ,  YI-FAN KAO ,  SHUO-HSUN CHANG ,  YU-TE LU ,  KUO-CHUN HUANG

IPC: H01L23/14 ,  H01L23/15 ,  H01L23/00

CPC classification number: H01L24/81 ,  H01L23/3128 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49833 ,  H01L23/562 ,  H01L24/16 ,  H01L25/105 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2225/1023 ,  H01L2225/107 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/18161 ,  H01L2924/3511 ,  H05K1/0206 ,  H05K1/0271 ,  H05K1/183 ,  H05K3/4697 ,  H05K2201/10378 ,  H05K2201/10734 ,  H05K2203/061 ,  H01L2924/00 ,  H01L2224/05599

Abstract: A compound carrier board structure of Flip-Chip Chip-Scale Package and manufacturing method thereof provides a baseplate having a flip region with a through-opening and bonding to a Non-conductive Film to bond to a carrier board in order to form a compound carrier board structure. Therefore, when a die is planted in the film region of the carrier board structure, the carrier board is able to susceptible to different stresses during a package process. The baseplate uses the low Thermal Expansion Coefficient material to avoid warpage problems caused by the thermal expansion of the carrier board resulting from the thermal stresses. The carrier board is able to disperse conduction of thermal stresses by the baseplate in order to strengthen cooling effect of the compound carrier board structure. Thus, the present invention achieves miniaturization and heat strengthening and enhances the mechanical strength.

Abstract translation: Flip-Chip Chip-Scale封装的复合载体板结构及其制造方法提供了一种具有通孔的翻转区和与非导电膜结合以结合到载体板以形成化合物载体的底板 板结构。 因此，当将模具种植在载体板结构的膜区域中时，载体板在包装过程中能够受到不同的应力的影响。 底板采用低热膨胀系数材料，以避免由热应力引起的载板热膨胀引起的翘曲问题。 承载板能够分散基板的热应力传导，以加强复合载体板结构的冷却效果。 因此，本发明实现了小型化和热强化，并提高了机械强度。

公开(公告)号：US20170345748A1

公开(公告)日：2017-11-30

申请号：US15678130

申请日：2017-08-16

Applicant: KINSUS INTERCONNECT TECHNOLOGY CORP.

Inventor： TING-HAO LIN ,  YI-FAN KAO ,  SHUO-HSUN CHANG ,  YU-TE LU ,  KUO-CHUN HUANG

IPC: H01L23/498 ,  H01L23/00 ,  H01L21/56 ,  H01L23/367 ,  H01L23/31 ,  H01L23/13 ,  H01L21/48 ,  H01L23/538

CPC classification number: H01L23/49833 ,  H01L21/4857 ,  H01L21/486 ,  H01L21/565 ,  H01L23/13 ,  H01L23/3114 ,  H01L23/3128 ,  H01L23/3142 ,  H01L23/367 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/5389 ,  H01L23/562 ,  H01L24/16 ,  H01L24/81 ,  H01L25/105 ,  H01L2224/16227 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2225/1023 ,  H01L2225/107 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/1533 ,  H01L2924/15787 ,  H01L2924/18161 ,  H01L2924/3511 ,  H05K1/0206 ,  H05K1/0271 ,  H05K1/183 ,  H05K3/4697 ,  H05K2201/10378 ,  H05K2201/10734 ,  H05K2203/061 ,  H01L2924/00

Abstract: A compound carrier board structure of Flip-Chip Chip-Scale Package and manufacturing method thereof provides a baseplate with an opening bonded to a carrier board in order to form a compound carrier board structure. A die is placed in the opening and bonded to the carrier board. A sealant is filled in a gap between surrounding walls of the opening and the die at a height lower than the die to fixedly place the die within the opening and to leave a non-active surface of the die exposed.

公开(公告)号：US20160197033A1

公开(公告)日：2016-07-07

申请号：US15071368

申请日：2016-03-16

Applicant: KINSUS INTERCONNECT TECHNOLOGY CORP.

Inventor： TING-HAO LIN ,  YI-FAN KAO ,  SHUO-HSUN CHANG ,  YU-TE LU ,  KUO-CHUN HUANG

IPC: H01L23/498 ,  H01L21/56 ,  H01L23/00

CPC classification number: H01L23/49833 ,  H01L21/4857 ,  H01L21/486 ,  H01L21/565 ,  H01L23/13 ,  H01L23/3114 ,  H01L23/3128 ,  H01L23/3142 ,  H01L23/367 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/5389 ,  H01L23/562 ,  H01L24/16 ,  H01L24/81 ,  H01L25/105 ,  H01L2224/16227 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2225/1023 ,  H01L2225/107 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/1533 ,  H01L2924/15787 ,  H01L2924/18161 ,  H01L2924/3511 ,  H05K1/0206 ,  H05K1/0271 ,  H05K1/183 ,  H05K3/4697 ,  H05K2201/10378 ,  H05K2201/10734 ,  H05K2203/061 ,  H01L2924/00

Abstract: A compound carrier board structure of Flip-Chip Chip-Scale Package and manufacturing method thereof provides a baseplate with a penetrating rectangular opening bonded to a non-conductive film then a carrier board in order to form a compound carrier board structure. The baseplate is constructed with a low Thermal Expansion Coefficient material.

Abstract translation: 倒装芯片尺寸封装的复合载体板结构及其制造方法提供了一种具有与非导电膜接合的穿透矩形开口的基板，然后形成载体板以形成复合载体板结构。 底板由低热膨胀系数材料构成。