公开(公告)号：US20160181188A1

公开(公告)日：2016-06-23

申请号：US14572904

申请日：2014-12-17

Applicant: KINSUS INTERCONNECT TECHNOLOGY CORP.

Inventor： TING-HAO LIN ,  CHIAO-CHENG CHANG ,  YI-NUNG LIN

IPC: H01L23/498

CPC classification number: H01L23/49827 ,  H01L23/49816 ,  H01L23/49833 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/0002 ,  H01L2924/15311 ,  H01L2924/00

Abstract: An ameliorated compound carrier board structure of Flip-Chip Chip-Scale Package has the insulating layer between the carrier board and the substrate in the prior art replaced by an anisotropic conductive film or materials with similar structure. The anisotropic conductive film has conductive particles therein to replace the conductive openings on the insulating layer in the prior art. When compressing the substrate onto the carrier board, the bottom surface of the second electrode pads are compressing the corresponding conductive particles on the second electrical contact pads, causing which to burst, therefore forming high-density compressed areas that conduct the second electrode pads and the second electrical contact pads; the conductive particles outside the high-density compressed area are not burst, forming an insulating film between the substrate and the carrier board: in other words, the anisotropic conductive film provides conduction in a Z direction. The structure can avoid the inaccuracies of distance and size of the conductive openings and the inaccuracy of the contact between the second electrode pads and the second electrical contact pads.

Abstract translation: 翻转芯片尺寸封装的改进的复合载体板结构在现有技术中在载体板和衬底之间具有由各向异性导电膜或具有相似结构的材料代替的绝缘层。 各向异性导电膜在其中具有导电颗粒以替代现有技术中的绝缘层上的导电开口。 当将衬底压缩到载体板上时，第二电极焊盘的底表面压缩第二电接触焊盘上相应的导电颗粒，从而使其破裂，从而形成传导第二电极焊盘的高密度压缩区域 第二电接触垫; 高密度压缩区域外的导电粒子不会突发，在基板和载板之间形成绝缘膜：换句话说，各向异性导电膜在Z方向上提供导电。 该结构可以避免导电开口的距离和尺寸的不准确以及第二电极焊盘和第二电接触焊盘之间的接触的不准确性。