公开(公告)号：US20150041183A1

公开(公告)日：2015-02-12

申请号：US13960082

申请日：2013-08-06

Applicant: KINSUS INTERCONNECT TECHNOLOGY CORP.

Inventor： Jun-Chung Hsu ,  Yu-Hui Wu ,  Huei-Cheng Hong

IPC: H05K1/11 ,  H05K1/02

CPC classification number: H05K1/09 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2924/19105 ,  H05K1/111 ,  H05K3/284 ,  H05K3/3436 ,  H05K3/368 ,  H05K2201/0338 ,  Y02P70/611 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A chip board package structure includes a circuit board part, a chip board part and a solder used to solder the circuit board part and the chip board part. A chip on the chip board part is connected to an electrical circuit by wiring or soldering. A surface treatment metal layer includes at least nickel, palladium and gold formed on part of the surface of the circuit layer on the chip board. A copper-tin intermetallic compound is formed on joints of the second solder and the surface treatment metal layer, and the other part of the circuit layer is directly connected to the solder to form the copper-tin intermetallic compound. In addition to the lower package cost, with the shape feature of the copper-tin intermetallic compound, it is possible to increase the contact area with the solder, thereby improving the reliability of the soldering process and the yield.

Abstract translation: 芯片组封装结构包括电路板部分，芯片板部分和用于焊接电路板部分和芯片板部分的焊料。 芯片部分的芯片通过布线或焊接连接到电路。 表面处理金属层至少包括在芯片板上的电路层表面的一部分上形成的镍，钯和金。 在第二焊料和表面处理金属层的接合部上形成铜锡金属间化合物，电路层的另一部分与焊锡直接连接，形成铜锡金属间化合物。 除了较低的封装成本之外，通过铜 - 锡金属间化合物的形状特征，可以增加与焊料的接触面积，从而提高焊接工艺的可靠性和产率。

公开(公告)号：US20150027756A1

公开(公告)日：2015-01-29

申请号：US13948274

申请日：2013-07-23

Applicant: KINSUS INTERCONNECT TECHNOLOGY CORP.

Inventor： Jun-Chung Hsu ,  Yu-Hui Wu

IPC: H05K1/02

CPC classification number: H05K1/0237 ,  H05K1/0242 ,  H05K2201/098

Abstract: A circuit board structure for high frequency signals includes a substrate and an electrical conductive circuit layer formed on the substrate. The conductive circuit layer includes circuit patterns and connection pads. The circuit pattern includes a base part with a shape of a rectangular block and a circular top part with a hemispherical shape provided on the base part. The circular top part can be modified by a circular bottom part embedded in the dielectric plastic film. Alternatively, a double layer structure with the circular top and bottom parts is formed such that the surface of the circuit pattern is provided with hemispheres to strengthen the reflection, thereby overcoming the problem of signal concentration due to the rectangular structure or the issue of signal attenuation due to surface roughness.

Abstract translation: 用于高频信号的电路板结构包括基板和形成在基板上的导电电路层。 导电电路层包括电路图案和连接焊盘。 电路图案包括具有矩形块形状的基部和设置在基部上的具有半球形状的圆顶部。 圆形顶部可以通过嵌入在介电塑料膜中的圆形底部部分进行修改。 或者，形成具有圆形顶部和底部的双层结构，使得电路图案的表面设置有半球以加强反射，从而克服由于矩形结构引起的信号集中或信号衰减的问题 由于表面粗糙度。