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公开(公告)号:AU7130800A
公开(公告)日:2001-04-17
申请号:AU7130800
申请日:2000-09-13
Applicant: KIONIX INC
Inventor: ADAMS SCOTT G , GROVES JAMES , CARDARELLI DONATO , CARROLL RAYMOND , DAUWALTER CHARLES R
Abstract: An oscillatory gyroscope is described with decoupled drive and sense oscillators and reduced cross-axis sensitivity. The gyroscope is fabricated using a plasma micromachining process on standard silicon wafers. The electrical isolation of the drive and sense functions of the gyroscope, contained within the same micromechanical element, reduce cross-coupling while obtaining high inertial mass and high sensitivity.
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公开(公告)号:NO20073803A
公开(公告)日:2007-10-17
申请号:NO20073803
申请日:2007-07-20
Applicant: KIONIX INC
Inventor: ADAMS SCOTT G , MILLER SCOTT A , SHEN-EPSTEIN JUNE , EPSTEIN KEITH
IPC: G01P15/18 , G01P15/125
CPC classification number: G01P15/125 , G01P15/0802 , G01P15/18 , G01P2015/0828
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公开(公告)号:CA2595755A1
公开(公告)日:2007-05-31
申请号:CA2595755
申请日:2006-11-16
Applicant: KIONIX INC
Inventor: EPSTEIN KEITH , ADAMS SCOTT G , MILLER SCOTT A , SHEN-EPSTEIN JUNE
IPC: G01P15/18 , G01P15/125 , H01L21/00
Abstract: In an embodiment of the present invention there is provided a micro-electromechanical (MEMS) accelerometer, including a substrate, a first sensor and a second sensor. The first sensor is configured to measure an acceleration along a first axis parallel to a plane of the substrate. The second sensor is configured to measure an acceleration along an axis perpendicular to the plane of the substrate. The second sensor comprises a first beam, a second beam and a single support structure. The single support structure supports the first and second beams relative to the substrate, wherein the first and second beams circumscribe the first sensor.
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公开(公告)号:AU2002353816A1
公开(公告)日:2003-05-06
申请号:AU2002353816
申请日:2002-10-16
Applicant: KIONIX INC
Inventor: JOHNSON WENDY JO H , MILLER SCOTT A , ADAMS SCOTT G
IPC: G01P9/04 , G01P15/125 , G01P15/08 , H01L29/00
Abstract: An accelerometer. A silicon wafer is etched to form a fixed portion, a movable portion, and a resilient coupling between, the fixed and movable portions generally arranged in the plane of the wafer, the mass of the movable portion being concentrated on one side of the resilient coupling. One of the fixed and moveable portions of the silicon structure includes a first electrode. The other of the fixed and moveable portions includes a second electrode oriented parallel to the axis of acceleration, and an electrically-conductive layer electrically connected as a third electrode coplanar and mechanically coupled with the second electrode. The second and third electrodes are arranged in capacitive opposition to the first electrode, the capacitance between the first electrode and third electrode increasing as the movable portion moves in a direction along the axis of acceleration relative to the fixed portion and decreasing as the movable portion moves in an opposite direction. A resilient coupling retains the first and third electrodes in capacitive opposition to each other across a capacitance gap while allowing motion of the first electrode relative to the second and third electrodes in response to acceleration along an axis of acceleration perpendicular to the plane of the wafer, and resiliently restores the first electrode to an equilibrium position when the acceleration ceases. The second electrode is in opposition to a majority of the surface area of the first electrode when the electrodes are in the equilibrium position. Capacitance between the first and third electrodes is measured to obtain a measurement of acceleration along the axis.
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公开(公告)号:HK1076653A1
公开(公告)日:2006-01-20
申请号:HK05108572
申请日:2005-09-29
Applicant: KIONIX INC
Inventor: ADAMS SCOTT G , MILLER SCOTT A , JOHNSON WENDY JO H
IPC: G01P20060101 , G01P9/04 , G01P15/125 , H01L20060101
Abstract: An accelerometer. A silicon wafer is etched to form a fixed portion, a movable portion, and a resilient coupling between, the fixed and movable portions generally arranged in the plane of the wafer, the mass of the movable portion being concentrated on one side of the resilient coupling. One of the fixed and moveable portions of the silicon structure includes a first electrode. The other of the fixed and moveable portions includes a second electrode oriented parallel to the axis of acceleration, and an electrically-conductive layer electrically connected as a third electrode coplanar and mechanically coupled with the second electrode. The second and third electrodes are arranged in capacitive opposition to the first electrode, the capacitance between the first electrode and third electrode increasing as the movable portion moves in a direction along the axis of acceleration relative to the fixed portion and decreasing as the movable portion moves in an opposite direction. A resilient coupling retains the first and third electrodes in capacitive opposition to each other across a capacitance gap while allowing motion of the first electrode relative to the second and third electrodes in response to acceleration along an axis of acceleration perpendicular to the plane of the wafer, and resiliently restores the first electrode to an equilibrium position when the acceleration ceases. The second electrode is in opposition to a majority of the surface area of the first electrode when the electrodes are in the equilibrium position. Capacitance between the first and third electrodes is measured to obtain a measurement of acceleration along the axis.
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公开(公告)号:AU2002368527A1
公开(公告)日:2004-07-22
申请号:AU2002368527
申请日:2002-12-26
Applicant: KIONIX INC
Inventor: MILLER SCOTT A , ADAMS SCOTT G
IPC: B81B3/00 , H01L21/762 , H01H51/22
Abstract: A relay for switching an electrical signal includes switching elements, an actuator for closing the switch, and an actuator for opening the switch, the latter two of which are mechanically decoupled when the relay is in a mechanical rest position. When a relay close signal is applied, the closing actuator electrostatically drives the switching elements to complete a signal path between two terminals for the switched signal. In the process of closing the switch, the opening actuator remains stationary, i.e., no mass is displaced. Application of a switch open signal electrostatically drives the opening actuator, optionally in combination with a mechanical restoring force on the closing actuator, to open the switch to break the signal conduction path for the switched signal.
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公开(公告)号:CA2595755C
公开(公告)日:2012-02-07
申请号:CA2595755
申请日:2006-11-16
Applicant: KIONIX INC
Inventor: ADAMS SCOTT G , MILLER SCOTT A , SHEN-EPSTEIN JUNE , EPSTEIN KEITH
IPC: G01P15/18 , G01P15/125 , H01L21/00
Abstract: In an embodiment of the present invention there is provided a micro-electromechanical (MEMS) accelerometer, including a substrate, a first sensor and a second sensor. The first sensor is configured to measure an acceleration along a first axis parallel to a plane of the substrate. The second sensor is configured to measure an acceleration along an axis perpendicular to the plane of the substrate. The second sensor comprises a first beam, a second beam and a single support structure. The single support structure supports the first and second beams relative to the substrate, wherein the first and second beams circumscribe the first sensor. In another embodiment, the MEMS accelerometer can include a third sensor configured to measure the acceleration along the axis perpendicular to the plane of the substrate. A MEMS accelerometer according to an embodiment of the invention can be insensitive to changes in temperature and/or stresses imposed on the packaging unit.
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公开(公告)号:DE60044782D1
公开(公告)日:2010-09-16
申请号:DE60044782
申请日:2000-09-13
Applicant: KIONIX INC , MILLISENSOR SYSTEMS AND ACTUAT
Inventor: ADAMS SCOTT G , GROVES JAMES , CARDARELLI DONATO , CARROLL RAYMOND , DAUWALTER CHARLES R
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公开(公告)号:CA2467503A1
公开(公告)日:2003-05-01
申请号:CA2467503
申请日:2002-10-16
Applicant: KIONIX INC
Inventor: MILLER SCOTT A , JOHNSON WENDY JO H , ADAMS SCOTT G
IPC: G01P9/04 , G01P15/125 , H01L29/00 , G01P15/08
Abstract: An accelerometer (100) comprising a silicon wafer is etched to form a fixed portion (400), a movable portion (300), and a resilient coupling (120) between, the fixed and movable portions generally arranged in the plane of t he wafer, the mass of the movable portion being concentrated on one side of the resilient coupling. One of the fixed and moveable portions of the silicon structure includes a first electrode. The other of the fixed and moveable portions includes a second electrode oriented parallel to the axis of acceleration, and an electrically-conductive layer electrically connected as a third electrode coplanar and mechanically coupled with the second electrode. The second and third electrodes are arranged in capacitive opposition to the first electrode, the capacitance between the first electrode and third electrode increasing as the movable portion moves in a direction along the axis of acceleration relative to the fixed portion and decreasing as the movable portion moves in an opposite direction. A resilient coupling retains the first and third electrodes in capacitive opposition to each other across a capacitance gap while allowing motion of the first electrode relative to the second and third electrodes in response to acceleration along an axis of acceleration perpendicular to the plane of the wafer, and resiliently restor es the first electrode to an equilibrium position when the acceleration ceases. The second electrode is in opposition to a majority of the surface area of t he first electrode when the electrodes are in the equilibrium position. Capacitance between the first and third electrodes is measured to obtain a measurement of acceleration along the axis.
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公开(公告)号:CA2467503C
公开(公告)日:2009-12-22
申请号:CA2467503
申请日:2002-10-16
Applicant: KIONIX INC
Inventor: MILLER SCOTT A , JOHNSON WENDY JO H , ADAMS SCOTT G
IPC: G01P15/125 , G01P9/04 , G01P15/08 , H01L29/00
Abstract: An accelerometer (100) comprising a silicon wafer is etched to form a fixed portion (400), a movable portion (300), and a resilient coupling (120) between, the fixed and movable portions generally arranged in the plane of t he wafer, the mass of the movable portion being concentrated on one side of the resilient coupling. One of the fixed and moveable portions of the silicon structure includes a first electrode. The other of the fixed and moveable portions includes a second electrode oriented parallel to the axis of acceleration, and an electrically-conductive layer electrically connected as a third electrode coplanar and mechanically coupled with the second electrode. The second and third electrodes are arranged in capacitive opposition to the first electrode, the capacitance between the first electrode and third electrode increasing as the movable portion moves in a direction along the axis of acceleration relative to the fixed portion and decreasing as the movable portion moves in an opposite direction. A resilient coupling retains the first and third electrodes in capacitive opposition to each other across a capacitance gap while allowing motion of the first electrode relative to the second and third electrodes in response to acceleration along an axis of acceleration perpendicular to the plane of the wafer, and resiliently restor es the first electrode to an equilibrium position when the acceleration ceases. The second electrode is in opposition to a majority of the surface area of t he first electrode when the electrodes are in the equilibrium position. Capacitance between the first and third electrodes is measured to obtain a measurement of acceleration along the axis.
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