公开(公告)号：SG11201708137VA

公开(公告)日：2017-11-29

申请号：SG11201708137V

申请日：2016-04-06

Applicant: KLA TENCOR CORP

Inventor： SMITH MARK D ,  SOLOMON JOSE ,  SHERWIN STUART ,  MIEHER WALTER D ,  LEVY ADY

IPC: H01L21/66 ,  H01L21/687

Abstract: The determination of in-plane distortions of a substrate includes measuring one or more out-of-plane distortions of the substrate in an unchucked state, determining an effective film stress of a film on the substrate in the unchucked state based on the measured out-of-plane distortions of the substrate in the unchucked state, determining in-plane distortions of the substrate in a chucked state based on the effective film stress of the film on the substrate in the unchucked state and adjusting at least one of a process tool or an overlay tool based on at least one of the measured out-of-plane distortions or the determined in-plane distortions.