公开(公告)号：WO2013043831A3

公开(公告)日：2013-05-23

申请号：PCT/US2012056272

申请日：2012-09-20

Applicant: KLA TENCOR CORP ,  LIU XUEFENG ,  CHUANG YUNG-HO ALEX ,  FIELDEN JOHN ,  TSAI BIN-MING BENJAMIN ,  ZHANG JINGJING

Inventor： LIU XUEFENG ,  CHUANG YUNG-HO ALEX ,  FIELDEN JOHN ,  TSAI BIN-MING BENJAMIN ,  ZHANG JINGJING

IPC: H01L21/66

CPC classification number: G06F17/5018 ,  G03F7/70625 ,  G06F17/10 ,  G06F17/5081 ,  G06F19/00 ,  G06F2217/12 ,  G06F2217/14 ,  G06F2217/16 ,  H01L22/12 ,  H01L22/20

Abstract: System and methods for process aware metrology are provided. The method compries the steps of selecting nominal values and one or more different values of process parameters for one or more process steps used to form the structure on the wafer, simulating one or more characteristics of the structure that would be formed on the wafer using the nominal values, generating an initial model of the structure based on results of the simulating step, simulating the one or more characteristic of the structure that would be formed on the wafer using the one or more different values as input to the initial model, translating results of both of the simulating steps into the optical model of the structure, and determining parameterization of the optical model based on how the one or more characteristics of the structure vary between at least two of the nominal values and the one or more different values.

Abstract translation: 提供过程感知度量的系统和方法。 该方法包括为用于在晶片上形成结构的一个或多个工艺步骤选择标称值和一个或多个不同值的工艺参数的步骤，模拟将在晶片上形成的结构的一个或多个特性，使用 标称值，基于模拟步骤的结果生成结构的初始模型，使用一个或多个不同值作为初始模型的输入来模拟将在晶片上形成的结构的一个或多个特性，翻译结果 两个模拟步骤进入结构的光学模型，以及基于结构的一个或多个特性如何在至少两个标称值和一个或多个不同值之间变化来确定光学模型的参数化。

公开(公告)号：EP3120382A4

公开(公告)日：2017-10-25

申请号：EP15765881

申请日：2015-03-13

Applicant: KLA-TENCOR CORP

Inventor： CHUANG YUNG-HO ALEX ,  ZHANG JINGJING ,  FIELDEN JOHN

IPC: H01L27/146 ,  G01N21/88 ,  G01N21/95 ,  H01L21/66 ,  H01L27/148 ,  H01L31/107

CPC classification number: H01L27/14632 ,  G01N21/8806 ,  G01N21/9501 ,  G01N2201/061 ,  G01N2201/0638 ,  G01N2201/12 ,  H01L27/14609 ,  H01L27/1461 ,  H01L27/14612 ,  H01L27/1462 ,  H01L27/1464 ,  H01L27/14643 ,  H01L27/14645 ,  H01L27/14647 ,  H01L27/14681 ,  H01L27/14685 ,  H01L27/14687 ,  H01L27/14689 ,  H01L27/14698 ,  H01L27/14825 ,  H01L27/14831 ,  H01L27/14856 ,  H01L31/028 ,  H01L31/107 ,  H01L31/1804

公开(公告)号：EP2758990A4

公开(公告)日：2015-10-14

申请号：EP12833283

申请日：2012-09-20

Applicant: KLA TENCOR CORP

Inventor： LIU XUEFENG ,  CHUANG YUNG-HO ALEX ,  FIELDEN JOHN ,  TSAI BIN-MING BENJAMIN ,  ZHANG JINGJING

IPC: H01L21/66 ,  G03F7/20

CPC classification number: G06F17/5018 ,  G03F7/70625 ,  G06F17/10 ,  G06F17/5081 ,  G06F19/00 ,  G06F2217/12 ,  G06F2217/14 ,  G06F2217/16 ,  H01L22/12 ,  H01L22/20

Abstract: Systems and methods for process aware metrology are provided.

Abstract translation: 提供了流程感知度量的系统和方法。